Inventor · disambiguated record
John R. Mcmillan
Also filed as: MCMILLAN JOHN · MCMILLAN JOHN R · MCMILLAN JOHN ROBERT
16 granted patents·597 citations·filing 1979–2014
94Inventor score
Files withAMKOR ELECTRONICS INC3DEERE & CO3MCMILLAN JOHN ROBERT3UTAC HONG KONG LTD3AMKOR TECHNOLOGY INC2
Top patents by PatentIndex Score
16 records- 0197US6507102B2Printed circuit board with integral heat sink for semiconductor packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Jan 14, 2003·142 cites·19 claims
- 0290US5829988ASocket assembly for integrated circuit chip carrier packageAMKOR ELECTRONICS INC·Filed 1996·Granted Nov 3, 1998·111 cites·51 claims
- 0390US5650593AThermally enhanced chip carrier packageAMKOR ELECTRONICS INC·Filed 1995·Granted Jul 22, 1997·126 cites·31 claims
- 0488US7858443B2Leadless integrated circuit package having standoff contacts and die attach padUTAC HONG KONG LTD·Filed 2009·Granted Dec 28, 2010·19 cites·9 claims
- 0588US4264264ALoader mounting structureDEERE & CO·Filed 1979·Granted Apr 28, 1981·36 cites·8 claims
- 0685US6337228B1Low-cost printed circuit board with integral heat sink for semiconductor packageAMKOR TECHNOLOGY INC·Filed 1999·Granted Jan 8, 2002·69 cites·19 claims
- 0781US8736037B2Leadless integrated circuit package having standoff contacts and die attach padPOWELL KIRK·Filed 2010·Granted May 27, 2014·8 cites·20 claims
- 0873US9305889B2Leadless integrated circuit package having standoff contacts and die attach padUTAC HONG KONG LTD·Filed 2014·Granted Apr 5, 2016·3 cites·10 claims
- 0973US5827999AHomogeneous chip carrier packageAMKOR ELECTRONICS INC·Filed 1994·Granted Oct 27, 1998·48 cites·22 claims
- 1066US8828801B2Leadless array plastic package with various IC packaging configurationsUTAC HONG KONG LTD·Filed 2013·Granted Sep 9, 2014·2 cites·20 claims
- 1159US8513786B2Pre-bonded substrate for integrated circuit package and method of making the sameMCMILLAN JOHN ROBERT·Filed 2011·Granted Aug 20, 2013·1 cites·23 claims
- 1257US8338924B2Substrate for integrated circuit package with selective exposure of bonding compound and method of making thereofMCMILLAN JOHN ROBERT·Filed 2011·Granted Dec 25, 2012·1 cites·24 claims
- 1354US5252022AQuick attachment assembly for loader implementsDEERE & CO·Filed 1991·Granted Oct 12, 1993·23 cites·11 claims
- 1444US8569110B2Pre-bonded substrate for integrated circuit package and method of making the sameMCMILLAN JOHN ROBERT·Filed 2011·Granted Oct 29, 2013·0 cites·32 claims
- 1536US8486762B2Leadless array plastic package with various IC packaging configurationsMCMILLAN JOHN·Filed 2010·Granted Jul 16, 2013·0 cites·32 claims
- 1633US4906160ALoader support standDEERE & CO·Filed 1988·Granted Mar 6, 1990·8 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →