Inventor · disambiguated record
Arpit Yati
Also filed as: YATI ARPIT
11 granted patents·2 pending applications·8 citations·filing 2016–2025
81Inventor score
Top patents by PatentIndex Score
13 records- 0184US9940704B2Pre-layer defect site review using designKLA TENCOR CORP·Filed 2016·Granted Apr 10, 2018·5 cites·18 claims
- 0270US2025383610A1System and method for overlay measurement using design data and deep learning segmentationKLA CORP·Filed 2025·Application pending·0 cites
- 0369US10692690B2Care areas for improved electron beam defect detectionKLA TENCOR CORP·Filed 2017·Granted Jun 23, 2020·1 cites·20 claims
- 0468US11275361B2Systems and methods for predicting defects and critical dimension using deep learning in the semiconductor manufacturing processKLA TENCOR CORP·Filed 2017·Granted Mar 15, 2022·1 cites·20 claims
- 0560US10204416B2Automatic deskew using design files or inspection imagesKLA TENCOR CORP·Filed 2016·Granted Feb 12, 2019·1 cites·20 claims
- 0654US11967058B2Semiconductor overlay measurements using machine learningKLA CORP·Filed 2020·Granted Apr 23, 2024·0 cites·26 claims
- 0746US11880193B2System and method for rendering SEM images and predicting defect imaging conditions of substrates using 3D designKLA CORP·Filed 2019·Granted Jan 23, 2024·0 cites·20 claims
- 0846US10970834B2Defect discovery using electron beam inspection and deep learning with real-time intelligence to reduce nuisanceKLA TENCOR CORP·Filed 2018·Granted Apr 6, 2021·0 cites·14 claims
- 0945US11094053B2Deep learning based adaptive regions of interest for critical dimension measurements of semiconductor substratesKLA TENCOR CORP·Filed 2019·Granted Aug 17, 2021·0 cites·18 claims
- 1040US11035666B2Inspection-guided critical site selection for critical dimension measurementKLA TENCOR CORP·Filed 2018·Granted Jun 15, 2021·0 cites·16 claims
- 1140US9947596B2Range-based real-time scanning electron microscope non-visual binnerKLA TENCOR CORP·Filed 2016·Granted Apr 17, 2018·0 cites·16 claims
- 1238US10957608B2Guided scanning electron microscopy metrology based on wafer topographyKLA TENCOR CORP·Filed 2017·Granted Mar 23, 2021·0 cites·20 claims
- 1336US2019279914A1Region of interest and pattern of interest generation for critical dimension measurementKLA TENCOR CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →