Inventor · disambiguated record
Arthur Fong-Yuen Pun
Also filed as: PUN ARTHUR · PUN ARTHUR F · PUN ARTHUR FONG-YUEN
20 granted patents·6 pending applications·51 citations·filing 2005–2023
92Inventor score
Top patents by PatentIndex Score
26 records- 0193US12125806B2Electronic device packages with internal moisture barriersWOLFSPEED INC·Filed 2023·Granted Oct 22, 2024·1 cites·19 claims
- 0292US9406594B2Leadframe based light emitter components and related methodsCREE INC·Filed 2014·Granted Aug 2, 2016·14 cites·31 claims
- 0391US10074635B2Solid state light emitter devices and methodsCREE INC·Filed 2015·Granted Sep 11, 2018·10 cites·36 claims
- 0490US10468565B2LED package with multiple element light source and encapsulant having curved and/or planar surfacesCREE INC·Filed 2014·Granted Nov 5, 2019·11 cites·43 claims
- 0583US11742302B2Electronic device packages with internal moisture barriersWOLFSPEED INC·Filed 2020·Granted Aug 29, 2023·1 cites·19 claims
- 0680US8853712B2High efficacy semiconductor light emitting devices employing remote phosphor configurationsCREE INC·Filed 2012·Granted Oct 7, 2014·6 cites·33 claims
- 0776US10950769B2Light emitting diode (LED) components including multiple LED dies that are attached to lead framesCREE INC·Filed 2017·Granted Mar 16, 2021·2 cites·18 claims
- 0872US10453825B2Light emitting diode (LED) components and methodsCREE INC·Filed 2014·Granted Oct 22, 2019·2 cites·24 claims
- 0971US11189766B2Light emitting diode packagesCREE INC·Filed 2019·Granted Nov 30, 2021·1 cites·15 claims
- 1070US11101411B2Solid-state light emitting devices including light emitting diodes in package structuresCREE INC·Filed 2019·Granted Aug 24, 2021·1 cites·19 claims
- 1165US11688673B2Integrated passive device (IPD) components and a package and processes implementing the sameWOLFSPEED INC·Filed 2021·Granted Jun 27, 2023·0 cites·23 claims
- 1262US9437785B2Light emitting diodes including integrated backside reflector and die attachBERGMANN MICHAEL JOHN·Filed 2009·Granted Sep 6, 2016·2 cites·23 claims
- 1362US2022045253A1Light emitting diode packagesCREELED INC·Filed 2021·Application pending·0 cites
- 1460US11769757B2Light emitting diode (LED) components and methodsCREELED INC·Filed 2019·Granted Sep 26, 2023·0 cites·20 claims
- 1558US11424394B2LED package with multiple element light source and encapsulant having curved and/or planar surfacesCREELED INC·Filed 2019·Granted Aug 23, 2022·0 cites·19 claims
- 1654US9601673B2Light emitting diode (LED) components including LED dies that are directly attached to lead framesCREE INC·Filed 2014·Granted Mar 21, 2017·0 cites·27 claims
- 1754US2024105692A1Packaged flip chip radio frequency transistor amplifier circuitsWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 1853US12272660B2Transistor packages with improved die attachWOLFSPEED INC·Filed 2020·Granted Apr 8, 2025·0 cites·23 claims
- 1951US2024105570A1Transistor package and process of implementing the transistor packageWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 2051US2023253359A1Semiconductor die including a metal stackWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 2151US2016079472A1Semiconductor devices and related methodsCREE INC·Filed 2014·Application pending·0 cites
- 2250US11233183B2Light-emitting diodes, light-emitting diode arrays and related devicesCREELED INC·Filed 2019·Granted Jan 25, 2022·0 cites·39 claims
- 2348US11024613B2Lumiphoric material region arrangements for light emitting diode packagesCREE INC·Filed 2019·Granted Jun 1, 2021·0 cites·32 claims
- 2447US10439114B2Substrates for light emitting diodes and related methodsCREE INC·Filed 2017·Granted Oct 8, 2019·0 cites·36 claims
- 2544US11335833B2Light-emitting diodes, light-emitting diode arrays and related devicesCREELED INC·Filed 2018·Granted May 17, 2022·0 cites·16 claims
- 2641US2006276038A1Thermal desorption of oxide from surfacesPUN ARTHUR F·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →