Light emitting diode packages

Abstract

Solid-state lighting devices including light-emitting diodes (LEDs) and LED packages are disclosed. LED packages are provided with improved thermal and/or electrical coupling between LED chips and submounts or lead frames. Various configurations of submounts with via arrangements are disclosed to provide improved coupling between LED chips and submounts. LED chip contacts are disclosed with one or more openings that are registered with vias to provide more uniform mounting. Multiple LED chips may be arranged around a thermally conductive element on a submount, and a via in the submount may be registered with the thermally conductive element. Subassemblies are provided between LED chips and lead frames to improve electrical and thermal coupling. Underfill materials may be arranged between LED chips and lead frames to provide improved mechanical support.

1 . A light emitting diode (LED) package comprising:
 an LED chip mounted to a lead frame;   a underfill material arranged between the LED chip and the lead frame; and   an encapsulant material arranged on the LED chip and the underfill material.   
     
     
         2 . The LED package of  claim 1 , wherein a first contact of the LED chip is electrically and mechanically coupled with a first lead frame portion, and a second contact of the LED chip is electrically and mechanically coupled with a second lead frame portion. 
     
     
         3 . The LED package of  claim 2 , wherein the underfill material is arranged between the first lead frame portion and the second lead frame portion. 
     
     
         4 . The LED package of  claim 2 , wherein the underfill material is arranged between the first contact of the LED chip and the second contact of the LED chip. 
     
     
         5 . The LED package of  claim 1 , wherein the underfill material is arranged between lateral edges of the LED chip and the lead frame. 
     
     
         6 . The LED package of  claim 1 , wherein the underfill material comprises light-altering particles. 
     
     
         7 . The LED package of  claim 6 , wherein the light-altering particles comprise titanium dioxide (TiO 2 ) particles that are suspended in a binder. 
     
     
         8 . The LED package of  claim 7 , wherein the binder comprises silicone. 
     
     
         9 . The LED package of  claim 1 , wherein the underfill material comprises epoxy. 
     
     
         10 . The LED package of  claim 1 , wherein the underfill material comprises a material with a higher durometer value on a Shore D hardness scale than the encapsulant material. 
     
     
         11 . The LED package of  claim 1 , wherein the underfill material comprises a material with a durometer value on a Shore D hardness scale of at least 40. 
     
     
         12 . The LED package of  claim 11 , wherein the durometer value is in a range from 40 to 100. 
     
     
         13 . The LED package of  claim 1 , further comprising an insulating material on the lead frame, wherein the insulating material forms sidewalls of a cup in which the LED chip is arranged, and wherein the underfill material is arranged between the sidewalls of the cup. 
     
     
         14 . A light emitting diode (LED) package comprising:
 an LED chip mounted to a lead frame; and   a subassembly arranged between the LED chip and the lead frame, wherein the subassembly comprises a metal submount that is thermally coupled between the LED chip and the lead frame.   
     
     
         15 . The LED package of  claim 14 , wherein the subassembly further comprises:
 a first die attach pad that is configured to be electrically coupled with a first contact pad of the LED chip; and   a second die attach pad that is configured to be electrically coupled with a second contact pad of the LED chip.   
     
     
         16 . The LED package of  claim 15 , wherein the first die attach pad and the second die attach pad are electrically coupled to different portions of the lead frame by wirebonds. 
     
     
         17 . The LED package of  claim 15 , wherein the subassembly further comprises a dielectric layer arranged between the first die attach pad and the metal submount and arranged between the second die attach pad and the metal submount. 
     
     
         18 . The LED package of  claim 15 , wherein the LED chip is arranged in a flip-chip configuration on the first die attach pad and the second die attach pad. 
     
     
         19 . The LED package of  claim 14 , further comprising an underfill material arranged between the subassembly and the lead frame. 
     
     
         20 . The LED package of  claim 14 , further comprising an insulating material on the lead frame, wherein the insulating material forms sidewalls of a cup in which the LED chip and the subassembly are arranged. 
     
     
         21 - 39 . (canceled)