Inventor · disambiguated record
Eiji Hashino
Also filed as: HASHINO EIJI
13 granted patents·5 pending applications·130 citations·filing 1996–2013
91Inventor score
Files withNIPPON STEEL CORP10ISHIKAWA SHINJI2NIPPON STEEL MATERIALS CO LTD2BALL SEMICONDUCTOR CORP1HASHINO EIJI1
Top patents by PatentIndex Score
18 records- 0194US7465217B2CMP conditioner, method for arranging hard abrasive grains for use in CMP conditioner, and process for producing CMP conditionerNIPPON STEEL CORP·Filed 2006·Granted Dec 16, 2008·36 cites·5 claims
- 0273US8847390B2Lead-free solder bump bonding structureHASHINO EIJI·Filed 2013·Granted Sep 30, 2014·5 cites·5 claims
- 0370US8104663B2Solder ball mounting method and apparatusISHIKAWA SHINJI·Filed 2008·Granted Jan 31, 2012·4 cites·8 claims
- 0462US7285486B2Ball transferring method and apparatusNIPPON STEEL MATERIALS CO LTD·Filed 2005·Granted Oct 23, 2007·1 cites·1 claims
- 0561US7045389B1Method for fabricating a semiconductor devices provided with low melting point metal bumpsNIPPON STEEL CORP·Filed 2000·Granted May 16, 2006·9 cites·5 claims
- 0661US5765744AProduction of small metal bumpsNIPPON STEEL CORP·Filed 1996·Granted Jun 16, 1998·29 cites·6 claims
- 0760US6916731B2Ball transferring method and apparatusNIPPON STEEL CORP·Filed 2001·Granted Jul 12, 2005·8 cites·14 claims
- 0851US2008032495A1Ball transferring method and apparatusNIPPON STEEL MATERIALS CO LTD·Filed 2007·Application pending·0 cites
- 0947US2011107580A1Micro-ball removal method and removal device, and micro-ball collective mounting method and collective mounting apparatusISHIKAWA SHINJI·Filed 2009·Application pending·0 cites
- 1045US6909182B2Spherical semiconductor device and method for fabricating the sameBALL SEMICONDUCTOR CORP·Filed 2002·Granted Jun 21, 2005·3 cites·10 claims
- 1145US6509645B2Spherical semiconductor device and method for fabricating the sameNIPPON STEEL CORP·Filed 1999·Granted Jan 21, 2003·10 cites·1 claims
- 1244US2014109962A1Interconnector for solar cells, and solar cell moduleKOBAYASHI TAKAYUKI·Filed 2012·Application pending·0 cites
- 1342US6571007B1Ball-arranging substrate for forming bump, ball-arranging head, ball-arranging device, and ball-arranging methodNIPPON STEEL CORP·Filed 1997·Granted May 27, 2003·11 cites·17 claims
- 1438US2002132462A1Spherical semiconductor device and method for fabricating the sameNIPPON STEEL CORP·Filed 2001·Application pending·0 cites
- 1537US7045388B2Semiconductor device provided with low melting point metal bumpsNIPPON STEEL CORP·Filed 1997·Granted May 16, 2006·6 cites·6 claims
- 1637US2004072510A1Cmp conditioner, method for arranging rigid grains used for cmp conditioner, and method for manufacturing cmp conditionerFiled 2001·Application pending·0 cites
- 1736US5899376ATransfer of flux onto electrodes and production of bumps on electrodesNIPPON STEEL CORP·Filed 1996·Granted May 4, 1999·8 cites·6 claims
- 1829US6884708B2Method of partially plating substrate for electronic devicesNIPPON STEEL CORP·Filed 1997·Granted Apr 26, 2005·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →