Spherical semiconductor device and method for fabricating the same

Abstract

A spherical semiconductor device includes a spherical semiconductor element having one or more electrodes on its surface. Spherical conductive bumps are formed at the positions of the electrodes. The electrodes are so arranged as to contact a common plane. Spherical bumps constituting a group to be connected to the outside protrude above the spherical semiconductor element such that a predetermined gap is formed between a plane or a spherical surface capable of contacting the spherical bumps and the surface of the spherical semiconductor element. The spherical semiconductor device is connected to various circuit boards or another semiconductor device through the spherical bumps. This affords easy and accurate electrical connections to the outside.

15 . (Amended) A method for fabricating a spherical semiconductor device having spherical bumps on surface electrodes of a spherical semiconductor element, comprising the steps of: 
 temporarily arranging conductive balls for forming said spherical bmps, on an arrangement substrate at positions respectively corresponding to said surface electrodes; and    transferring said conductive balls onto said surface electrodes to join the electrodes.