Inventor · disambiguated record
Lequn Liu
Also filed as: LIU LEQUN · LIU LEQUN J · LIU LEQUN JENNIFER
23 granted patents·19 pending applications·44 citations·filing 2009–2025
92Inventor score
Top patents by PatentIndex Score
42 records- 0197US11295786B23D dram structure with high mobility channelAPPLIED MATERIALS INC·Filed 2020·Granted Apr 5, 2022·5 cites·8 claims
- 0293US9093367B2Methods of forming doped regions in semiconductor substratesMICRON TECHNOLOGY INC·Filed 2013·Granted Jul 28, 2015·11 cites·7 claims
- 0390US10437120B1Methods and systems for displaying high dynamic range imagesOMNIVISION TECH INC·Filed 2018·Granted Oct 8, 2019·5 cites·20 claims
- 0489US9559146B2Phase-change memory cell implant for dummy array leakage reductionINTEL CORP·Filed 2014·Granted Jan 31, 2017·6 cites·12 claims
- 0585US9324945B2Memory cells and methods of forming memory cellsMICRON TECHNOLOGY INC·Filed 2013·Granted Apr 26, 2016·5 cites·48 claims
- 0679USD972505SCharger boxLIU LEQUN·Filed 2022·Granted Dec 13, 2022·7 cites·1 claims
- 0777US9837604B2Phase-change memory cell implant for dummy array leakage reductionINTEL CORP·Filed 2017·Granted Dec 5, 2017·2 cites·8 claims
- 0872US2025028242A1Integrated solution with low temperature dry develop for euv photoresistAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0969US8274081B2Semiconductor constructionsMIKHALEV VLADIMIR·Filed 2010·Granted Sep 25, 2012·2 cites·6 claims
- 1068US8497194B2Methods of forming doped regions in semiconductor substratesMICRON TECHNOLOGY INC·Filed 2012·Granted Jul 30, 2013·1 cites·8 claims
- 1167US2025227915A1Methods and devices for reduced floating body effect in advanced dramAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1267US2024160100A1Integrated solution with low temperature dry develop for euv photoresistAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1366US11751382B2Method of processing dramAPPLIED MATERIALS INC·Filed 2022·Granted Sep 5, 2023·0 cites·16 claims
- 1464US2025351329A1Non-line-of-sight junction formationAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1563US2025185230A1Methods of forming memory structures using seamless gapfillAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1662US2024272552A1Preferential infiltration in lithographic process flow for euv car resistAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1761US11164938B2DRAM capacitor moduleMICROMATERIALS LLC·Filed 2020·Granted Nov 2, 2021·0 cites·16 claims
- 1861US2022013624A1DRAM Capacitor ModuleMICROMATERIALS LLC·Filed 2021·Application pending·0 cites
- 1960US12183631B2Methods for copper doped hybrid metallization for line and viaAPPLIED MATERIALS INC·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 2060US11749315B23D DRAM structure with high mobility channelAPPLIED MATERIALS INC·Filed 2021·Granted Sep 5, 2023·0 cites·12 claims
- 2160US11329052B2Method of processing DRAMAPPLIED MATERIALS INC·Filed 2020·Granted May 10, 2022·0 cites·13 claims
- 2260US10566364B2Resonant-filter image sensor and associated fabrication methodOMNIVISION TECH INC·Filed 2019·Granted Feb 18, 2020·0 cites·5 claims
- 2359US2024136229A1Channel uniformity horizontal gate all around deviceAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2459US2024290883A1Void-free stress incorporation in semiconductor devicesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2558US2025385093A1Underlayer with fluorine for extreme ultraviolet (euv) lithographyAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2658US2025385101A1Extreme ultraviolet (euv) activated underlayerAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2758US2024038553A1Processing methods and cluster tools for forming semiconductor devicesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2856US8283708B2Semiconductor devices and methods of forming semiconductor devices having diffusion regions of reduced widthLIU LEQUN·Filed 2009·Granted Oct 9, 2012·0 cites·17 claims
- 2956US2024071773A1Ion implantation for increased adhesion with resist materialAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3053US10996426B23D imaging using phase detection autofocus (PDAF) image sensorOMNIVISION TECH INC·Filed 2019·Granted May 4, 2021·0 cites·18 claims
- 3153US10290670B2Resonant-filter image sensor and associated fabrication methodOMNIVISION TECH INC·Filed 2016·Granted May 14, 2019·0 cites·14 claims
- 3253US2023005844A1Structures with copper doped hybrid metallization for line and viaAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3352US8906771B2Semiconductor processing methods, and methods of forming isolation structuresMIKHALEV VLADIMIR·Filed 2012·Granted Dec 9, 2014·0 cites·21 claims
- 3451US8709929B2Methods of forming semiconductor devices having diffusion regions of reduced widthLIU LEQUN·Filed 2012·Granted Apr 29, 2014·0 cites·19 claims
- 3550US10317733B2Method to make LCOS oxide alignment layer by offset printOMNIVISION TECH INC·Filed 2016·Granted Jun 11, 2019·0 cites·7 claims
- 3649US2017287966A1Image Sensor Contact EnhancementOMNIVISION TECH INC·Filed 2017·Application pending·0 cites
- 3748US11454751B2Eye wear visually enhancing laser spot and laser lineJUTAMULIA SUGANDA·Filed 2019·Granted Sep 27, 2022·0 cites·18 claims
- 3846US9401285B2Chemical mechanical planarization topography control via implantMICRON TECHNOLOGY INC·Filed 2014·Granted Jul 26, 2016·0 cites·25 claims
- 3946US2017207269A1Image sensor contact enhancementOMNIVISION TECH INC·Filed 2016·Application pending·0 cites
- 4045US2016027863A1Integrated Circuitry, Methods of Forming Capacitors, and Methods of Forming Integrated Circuitry Comprising an Array of Capacitors and Circuitry Peripheral to the ArrayMICRON TECHNOLOGY INC·Filed 2015·Application pending·0 cites
- 4143US2021121934A1Method and Device for Continuously Forming Wood/Bamboo Molded Hollow Wallboard with Embedded Reinforcing RibsZHEJIANG ACADEMY FORESTRY·Filed 2020·Application pending·0 cites
- 4239US2019302881A1Display device and methods of operationOMNIVISION TECH INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →