Inventor · disambiguated record
Michael Kwan
Also filed as: KWAN MICHAEL · KWAN MICHAEL C · KWAN MICHAEL CHIU
14 granted patents·6 pending applications·1,008 citations·filing 1998–2023
94Inventor score
Files withAPPLIED MATERIALS INC12NOVA MEASURING INSTR INC5JUNG KEE BUM1MASSACHUSETTS INST TECHNOLOGY1REVERA INCORPORATED1
Top patents by PatentIndex Score
20 records- 0199US7253123B2Method for producing gate stack sidewall spacersAPPLIED MATERIALS INC·Filed 2005·Granted Aug 7, 2007·253 cites·24 claims
- 0297US6335288B1Gas chemistry cycling to achieve high aspect ratio gapfill with HDP-CVDAPPLIED MATERIALS INC·Filed 2000·Granted Jan 1, 2002·378 cites·15 claims
- 0397US6045877APyrolytic chemical vapor deposition of silicone filmsMASSACHUSETTS INST TECHNOLOGY·Filed 1998·Granted Apr 4, 2000·258 cites·24 claims
- 0493US7407893B2Liquid precursors for the CVD deposition of amorphous carbon filmsAPPLIED MATERIALS INC·Filed 2005·Granted Aug 5, 2008·33 cites·20 claims
- 0591US11029148B2Feed-forward of multi-layer and multi-process information using XPS and XRF technologiesNOVA MEASURING INSTR INC·Filed 2020·Granted Jun 8, 2021·2 cites·20 claims
- 0689US10648802B2Feed-forward of multi-layer and multi-process information using XPS and XRF technologiesNOVA MEASURING INSTR INC·Filed 2019·Granted May 12, 2020·2 cites·20 claims
- 0782US7638440B2Method of depositing an amorphous carbon film for etch hardmask applicationAPPLIED MATERIALS INC·Filed 2004·Granted Dec 29, 2009·27 cites·28 claims
- 0881US10082390B2Feed-forward of multi-layer and multi-process information using XPS and XRF technologiesREVERA INCORPORATED·Filed 2015·Granted Sep 25, 2018·2 cites·20 claims
- 0981US2024085174A1Feed-forward of multi-layer and multi-process information using xps and xrf technologiesNOVA MEASURING INSTR INC·Filed 2023·Application pending·0 cites
- 1073US11733035B2Feed-forward of multi-layer and multi-process information using XPS and XRF technologiesNOVA MEASURING INSTR INC·Filed 2021·Granted Aug 22, 2023·0 cites·7 claims
- 1173US6596123B1Method and apparatus for cleaning a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 2000·Granted Jul 22, 2003·15 cites·13 claims
- 1272US6812153B2Method for high aspect ratio HDP CVD gapfillAPPLIED MATERIALS INC·Filed 2002·Granted Nov 2, 2004·13 cites·7 claims
- 1371US7052552B2Gas chemistry cycling to achieve high aspect ratio gapfill with HDP-CVDAPPLIED MATERIALS INC·Filed 2001·Granted May 30, 2006·13 cites·6 claims
- 1469US2019033069A1Feed-forward of multi-layer and multi-process information using xps and xrf technologiesNOVA MEASURING INSTR INC·Filed 2018·Application pending·0 cites
- 1568US6715496B2Method and apparatus for cleaning a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 2003·Granted Apr 6, 2004·10 cites·12 claims
- 1650US7064077B2Method for high aspect ratio HDP CVD gapfillAPPLIED MATERIALS INC·Filed 2004·Granted Jun 20, 2006·2 cites·20 claims
- 1747US2006162661A1Mixing energized and non-energized gases for silicon nitride depositionAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 1847US2012009803A1Mixing Energized and Non-Energized Gases for Silicon Nitride DepositionJUNG KEE BUM·Filed 2011·Application pending·0 cites
- 1941US2006105106A1Tensile and compressive stressed materials for semiconductorsAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 2036US2005199585A1Method of depositing an amorphous carbon film for metal etch hardmask applicationAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →