Inventor · disambiguated record
Shripad Gokhale
Also filed as: GOKHALE SHRIPAD
9 granted patents·9 pending applications·26 citations·filing 2006–2025
83Inventor score
Top patents by PatentIndex Score
18 records- 0188US2025329604A1Microelectronics package comprising a package-on-package (pop) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2025·Application pending·0 cites
- 0284US12417958B2Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zoneINTEL CORP·Filed 2023·Granted Sep 16, 2025·0 cites·14 claims
- 0383US12347743B2Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 0483US7687890B2Controlling substrate surface properties via colloidal coatingsINTEL CORP·Filed 2007·Granted Mar 30, 2010·7 cites·20 claims
- 0581US2024014097A1Microelectronics package comprising a package-on-package (pop) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2023·Application pending·0 cites
- 0680US7875503B2Reducing underfill keep out zone on substrate used in electronic device processingINTEL CORP·Filed 2006·Granted Jan 25, 2011·11 cites·20 claims
- 0777US9508610B2Inline measurement of molding material thickness using terahertz reflectanceINTEL CORP·Filed 2014·Granted Nov 29, 2016·5 cites·15 claims
- 0869US8362627B2Reducing underfill keep out zone on substrate used in electronic device processingINTEL CORP·Filed 2010·Granted Jan 29, 2013·3 cites·11 claims
- 0967US12394773B2Laser ablation-based surface property modification and contamination removalINTEL CORP·Filed 2023·Granted Aug 19, 2025·0 cites·17 claims
- 1065US12315777B2Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zoneINTEL CORP·Filed 2019·Granted May 27, 2025·0 cites·23 claims
- 1159US2025391807A1Dynamic substrate thermal displacement compensationINTEL CORP·Filed 2024·Application pending·0 cites
- 1258US2025218998A1Low temperature solder interconnect for package pitch scalingINTEL CORP·Filed 2023·Application pending·0 cites
- 1357US2025112174A1Annealed shape memory alloy on a substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 1455US2025112164A1Controlling substrate bump heightINTEL CORP·Filed 2023·Application pending·0 cites
- 1553US12362340B2Laser ablation-based surface property modification and contamination removalINTEL CORP·Filed 2019·Granted Jul 15, 2025·0 cites·24 claims
- 1653US2025112136A1Glass core protection using peripheral buffer layersINTEL CORP·Filed 2023·Application pending·0 cites
- 1746US2024178097A1Permanent layer for bump chip attachINTEL CORP·Filed 2022·Application pending·0 cites
- 1838US2008142996A1Controlling flow of underfill using polymer coating and resulting devicesSUBRAMANIAN GOPALAKRISHNAN·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →