Inventor · disambiguated record
Shinichi Shinozuka
Also filed as: SHINOZUKA SHINICHI
16 granted patents·67 citations·filing 2004–2022
91Inventor score
Top patents by PatentIndex Score
16 records- 0193US11348791B2Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2020·Granted May 31, 2022·3 cites·2 claims
- 0293US7968825B2Temperature setting method of thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plateTOKYO ELECTRON LTD·Filed 2007·Granted Jun 28, 2011·29 cites·13 claims
- 0379US8242417B2Temperature control method of heat processing plate, computer storage medium, and temperature control apparatus of heat processing plateTADOKORO MASAHIDE·Filed 2007·Granted Aug 14, 2012·6 cites·15 claims
- 0479US7411669B2Substrate defect inspection method, computer readable storage medium, and defect inspection apparatusTOKYO ELECTRON LTD·Filed 2007·Granted Aug 12, 2008·5 cites·11 claims
- 0577US7957828B2Temperature setting method for thermal processing plate, temperature setting apparatus for thermal processing plate, and computer-readable storage mediumTOKYO ELECTRON LTD·Filed 2008·Granted Jun 7, 2011·6 cites·23 claims
- 0670US8698052B2Temperature control method of heat processing plate, computer storage medium, and temperature control apparatus of heat processing plateTADOKORO MASAHIDE·Filed 2012·Granted Apr 15, 2014·2 cites·20 claims
- 0769US12381083B2Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2022·Granted Aug 5, 2025·0 cites·12 claims
- 0868US8253077B2Substrate processing method, computer-readable storage medium and substrate processing systemOGATA KUNIE·Filed 2011·Granted Aug 28, 2012·2 cites·5 claims
- 0968US7985516B2Substrate processing method, computer-readable storage medium and substrate processing systemTOKYO ELECTRON LTD·Filed 2009·Granted Jul 26, 2011·2 cites·6 claims
- 1066US8041525B2Substrate measuring method, computer-readable recording medium recording program thereon, and substrate measuring systemTOKYO ELECTRON LTD·Filed 2007·Granted Oct 18, 2011·2 cites·7 claims
- 1166US7822574B2Substrate measuring method, computer-readable recording medium recording program thereon, and substrate processing systemTOKYO ELECTRON LTD·Filed 2007·Granted Oct 26, 2010·2 cites·3 claims
- 1264US7897896B2Temperature setting method of thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plateTOKYO ELECTRON LTD·Filed 2007·Granted Mar 1, 2011·2 cites·14 claims
- 1359US8135487B2Temperature setting method and apparatus for a thermal processing plateJYOUSAKA MEGUMI·Filed 2008·Granted Mar 13, 2012·2 cites·11 claims
- 1453US7529595B2Method of controlling substrate processing apparatus and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2004·Granted May 5, 2009·4 cites·14 claims
- 1547US12451374B2Bonding system and inspection method of inspecting combined substrateTOKYO ELECTRON LTD·Filed 2020·Granted Oct 21, 2025·0 cites·10 claims
- 1645US7867674B2Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such programTOKYO ELECTRON LTD·Filed 2006·Granted Jan 11, 2011·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →