Inventor · disambiguated record
Junichi Hagihara
Also filed as: HAGIHARA JUNICHI
21 granted patents·5 pending applications·335 citations·filing 1995–2023
95Inventor score
Top patents by PatentIndex Score
26 records- 0192US6344752B1Contactor and production method for contractorTOKYO ELECTRON LTD·Filed 1999·Granted Feb 5, 2002·83 cites·21 claims
- 0289US5825192AProbe card device used in probing apparatusTOKYO ELECTRON LTD·Filed 1996·Granted Oct 20, 1998·84 cites·10 claims
- 0386US12117485B2Wafer inspection systemTOKYO ELECTRON LTD·Filed 2023·Granted Oct 15, 2024·0 cites·1 claims
- 0486US8167521B2Substrate transfer apparatus and vertical heat processing apparatusNAKAO KEN·Filed 2007·Granted May 1, 2012·11 cites·10 claims
- 0586US7091733B2Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test methodIBIDEN CO LTD·Filed 2004·Granted Aug 15, 2006·30 cites·20 claims
- 0684US11762012B2Wafer inspection systemTOKYO ELECTRON LTD·Filed 2022·Granted Sep 19, 2023·0 cites·2 claims
- 0782US7981217B2Vertical heat treatment apparatus and method of transferring substrates to be processedTOKYO ELECTRON LTD·Filed 2008·Granted Jul 19, 2011·8 cites·8 claims
- 0882US7242206B2Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test methodIBIDEN CO LTD·Filed 2005·Granted Jul 10, 2007·7 cites·43 claims
- 0982US6590381B1Contactor holding mechanism and automatic change mechanism for contactorTOKYO ELECTRON LTD·Filed 2000·Granted Jul 8, 2003·27 cites·20 claims
- 1081US7777511B2Inspection apparatus having a capacitive pressure sensor between the mounting body and the support bodyTOKYO ELECTRON LTD·Filed 2008·Granted Aug 17, 2010·7 cites·8 claims
- 1180US9671459B2Maintenance carriage for wafer inspection apparatus and maintenance method for wafer inspection apparatusTOKYO ELECTRON LTD·Filed 2014·Granted Jun 6, 2017·2 cites·5 claims
- 1276US11567123B2Wafer inspection systemTOKYO ELECTRON LTD·Filed 2021·Granted Jan 31, 2023·0 cites·3 claims
- 1375US6438831B1Method of manufacturing an interconnectorTOKYO ELECTRON LTD·Filed 2000·Granted Aug 27, 2002·19 cites·10 claims
- 1474US11061071B2Wafer inspection system, wafer inspection apparatus and proberTOKYO ELECTRON LTD·Filed 2020·Granted Jul 13, 2021·0 cites·5 claims
- 1574US10976364B2Test head and wafer inspection apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Apr 13, 2021·0 cites·6 claims
- 1673US7791362B2Inspection apparatusTOKYO ELECTRON LTD·Filed 2008·Granted Sep 7, 2010·4 cites·4 claims
- 1771US5708222AInspection apparatus, transportation apparatus, and temperature control apparatusTOKYO ELECTRON LTD·Filed 1995·Granted Jan 13, 1998·47 cites·4 claims
- 1867US8456186B2Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test methodTAKEKOSHI KIYOSHI·Filed 2007·Granted Jun 4, 2013·2 cites·23 claims
- 1967US2020064400A1Wafer inspection system, wafer inspection apparatus and proberTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 2065US7859283B2Probe apparatus, probing method, and storage mediumTOKYO ELECTRON LTD·Filed 2009·Granted Dec 28, 2010·2 cites·13 claims
- 2163US10753972B2Wafer inspection system, wafer inspection apparatus and proberTOKYO ELECTRON LTD·Filed 2017·Granted Aug 25, 2020·0 cites·7 claims
- 2240US2008185176A1Wiring Board Member For Forming Multilayer Wiring Board, Method of Manufacturing the Same, and Multilayer Wiring BoardHAGIHARA JUNICHI·Filed 2004·Application pending·0 cites
- 2335US2007093079A1Imprinting method and imprinting apparatusTOKYO ELECTRON LTD·Filed 2004·Application pending·0 cites
- 2431USRE41515EContactor and production method for contactorTOKYO ELECTRON LTD·Filed 1999·Granted Aug 17, 2010·2 cites·27 claims
- 2531US2007187868A1Pasting method and pasting apparatusARUGA TSUYOSHI·Filed 2004·Application pending·0 cites
- 2627US2007105459A1Joining method and joining deviceARUGA TSUYOSHI·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →