Wafer inspection system, wafer inspection apparatus and prober

Abstract

A wafer inspection system is provided. The wafer inspection system comprises: a transfer region in which a transfer device is arranged; an inspection region in which test heads for inspecting a substrate are arranged; and a maintenance region in which the test heads are maintained. The inspection region is located between the transfer region and the maintenance region, a plurality of inspection rooms accommodating the test heads are adjacent to each other in the inspection region, and the test heads are configured to be unloaded from the inspection region to the maintenance region.

We claim: 
     
         1 . A prober for inspecting electrical characteristics of a semiconductor device formed on a substrate, the prober comprising:
 a probe card facing the substrate and having a plurality of probes;   test heads arranged at an opposite side of the substrate with respect to the probe card;   a lifting device configured to move the test heads up and down in a vertical direction; and   a slide mechanism configured to unload the test heads in a direction perpendicular to the vertical direction.   
     
     
         2 . The prober of  claim 1 ,
 wherein the slide mechanism includes a slide rail.