Inventor · disambiguated record
Hiromitsu Takashita
Also filed as: TAKASHITA HIROMITSU
11 granted patents·1 pending application·24 citations·filing 2010–2015
85Inventor score
Top patents by PatentIndex Score
12 records- 0188US8929092B2Circuit board, and semiconductor device having component mounted on circuit boardYOSHIOKA SHINGO·Filed 2010·Granted Jan 6, 2015·10 cites·5 claims
- 0285US9070393B2Three-dimensional structure in which wiring is provided on its surfacePANASONIC CORP·Filed 2014·Granted Jun 30, 2015·6 cites·2 claims
- 0379US9351402B2Circuit board, and semiconductor device having component mounted on circuit boardPANASONIC CORP·Filed 2014·Granted May 24, 2016·4 cites·2 claims
- 0474US9082438B2Three-dimensional structure for wiring formationPANASONIC CORP·Filed 2014·Granted Jul 14, 2015·2 cites·1 claims
- 0561US9082635B2Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit boardYOSHIOKA SHINGO·Filed 2011·Granted Jul 14, 2015·1 cites·9 claims
- 0660US9175151B2Resin composition and method for producing circuit boardPANASONIC CORP·Filed 2014·Granted Nov 3, 2015·0 cites·1 claims
- 0760US9082825B2Manufacturing method for semiconductor package, semiconductor package, and semiconductor devicePANASONIC CORP·Filed 2012·Granted Jul 14, 2015·1 cites·19 claims
- 0849US9332642B2Circuit boardPANASONIC CORP·Filed 2014·Granted May 3, 2016·0 cites·3 claims
- 0947US8877843B2Resin composition and method for producing circuit boardKONNO YUKO·Filed 2011·Granted Nov 4, 2014·0 cites·13 claims
- 1045US9669567B2Manufacturing method of molded articlePANASONIC CORP·Filed 2014·Granted Jun 6, 2017·0 cites·5 claims
- 1145US9204530B2Electronic components assemblyPANASONIC CORP·Filed 2013·Granted Dec 1, 2015·0 cites·7 claims
- 1243US2015271924A1Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module, and multilayer circuit boardPANASONIC CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →