Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module, and multilayer circuit board

Abstract

A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device 1 of which a plurality of connecting terminals are exposed, a resin film is formed on a surface of the insulating layer, a groove of a depth equal to or exceeding a thickness of the resin film is formed from a surface side of the resin film so that the groove passes in a vicinity of connecting terminals that are to be connected, and furthermore communicating holes which reach the connecting terminals to be connected from this portion that groove passes in the vicinity thereof are formed.

1 . A wiring method for mutually connecting by wiring a plurality of parts to be connected which are exposed on a surface of a structure, wherein the method comprising:
 an insulating layer forming step of forming an insulating layer on a surface of the structure where the plurality of parts to be connected are exposed; and   a wiring forming step of providing wiring having a main body section which is positioned on a surface of the insulating layer and a branch section which branches from the main body section, extends inside the insulating layer, and reaches a part to be connected of a connection object.   
     
     
         2 . The wiring method according to  claim 1 , wherein the wiring forming step comprises:
 a resin film forming step of forming a resin film on a surface of the insulating layer;   a groove and hole forming step of forming a groove having a depth equal to or exceeding a thickness of the resin film from a surface side of the resin film so that this groove passes in the vicinity of a part to be connected of a connection object, and also forming a communicating hole which reaches the part to be connected of a connection object, from the portion where the groove passes in the vicinity thereof;   a catalyst deposition step of depositing a plating catalyst or plating catalyst precursor on a surface of the groove and the communicating hole;   a resin film removal step of removing the resin film by dissolving or swelling this film; and   a plating step of forming a plating film only on a portion where the plating catalyst or a plating catalyst formed from the plating catalyst precursor remains, by carrying out electroless plating.   
     
     
         3 . The wiring method according to  claim 2 , wherein the wiring forming step further comprises:
 an electroplating step of thickening the plating film by carrying out electroplating after the plating step.   
     
     
         4 . The wiring method according to  claim 2 , wherein
 the resin film contains a fluorescent material, and   the wiring forming step further comprises:   an inspection step of inspecting for resin film removal defects by using fluorescent light from the fluorescent material, after the resin film removal step and before the plating step.   
     
     
         5 . The wiring method according to  claim 1 , further performing the following steps at least once after the wiring forming step:
 an insulating layer laminating step of further laminating an insulating layer on a surface of the insulating layer where the main body section of the wiring is exposed; and   an additional wiring forming step of providing wiring having a main body section which is positioned on a surface of the laminated insulating layer and a branch section which branches from the main body section, extends inside the insulating layer and reaches a part to be connected of a connection object.