Inventor · disambiguated record
Yuko Konno
Also filed as: KONNO YUKO
6 granted patents·7 pending applications·5 citations·filing 2011–2024
70Inventor score
Top patents by PatentIndex Score
13 records- 0164US2025224672A1Photosensitive resin film, printed wiring board, semiconductor package, and method for manufacturing printed wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0261US9082635B2Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit boardYOSHIOKA SHINGO·Filed 2011·Granted Jul 14, 2015·1 cites·9 claims
- 0360US9175151B2Resin composition and method for producing circuit boardPANASONIC CORP·Filed 2014·Granted Nov 3, 2015·0 cites·1 claims
- 0458US2025297129A1Photosensitive resin composition, photosensitive resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2024·Application pending·0 cites
- 0552US2024393686A1Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring boardRESONAC CORP·Filed 2021·Application pending·0 cites
- 0651US2025306465A1Photosensitive multilayer resin film, printed wiring board, semiconductor package, and method for producing printed wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0751US2025226236A1Photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0849US2025227853A1Photosensitive multilayer resin film, printed wiring board, semiconductor package, and method for producing printed wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0947US8877843B2Resin composition and method for producing circuit boardKONNO YUKO·Filed 2011·Granted Nov 4, 2014·0 cites·13 claims
- 1045US9204530B2Electronic components assemblyPANASONIC CORP·Filed 2013·Granted Dec 1, 2015·0 cites·7 claims
- 1143US2015271924A1Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module, and multilayer circuit boardPANASONIC CORP·Filed 2015·Application pending·0 cites
- 1240USD728399SWater quality analyzerDKK TOA CORP·Filed 2014·Granted May 5, 2015·4 cites·1 claims
- 1328US10473618B2Residual chlorine measuring apparatus and method of measuring residual chlorineKURITA WATER IND LTD·Filed 2016·Granted Nov 12, 2019·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →