Inventor · disambiguated record
Tac Keun Oh
Also filed as: OH TAC KEUN
14 granted patents·5 pending applications·112 citations·filing 2008–2017
91Inventor score
Top patents by PatentIndex Score
19 records- 0196US8618656B2Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the sameOH TAC KEUN·Filed 2011·Granted Dec 31, 2013·34 cites·8 claims
- 0294US7838979B2Stacked semiconductor package electrically connecting semiconductor chips using outer surfaces thereof and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Nov 23, 2010·34 cites·18 claims
- 0385US8198136B2Stacked semiconductor package electrically connecting semiconductor chips using outer surfaces thereof and method for manufacturing the sameOH TAC KEUN·Filed 2010·Granted Jun 12, 2012·8 cites·20 claims
- 0484US9299689B2Methods of fabricating semiconductor stack packagesSK HYNIX INC·Filed 2014·Granted Mar 29, 2016·6 cites·12 claims
- 0581US8803327B2Semiconductor packageSK HYNIX INC·Filed 2012·Granted Aug 12, 2014·6 cites·19 claims
- 0677US8049332B2Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Nov 1, 2011·6 cites·5 claims
- 0775US9716017B2Semiconductor packages including interposer and methods of manufacturing the sameSK HYNIX INC·Filed 2015·Granted Jul 25, 2017·2 cites·11 claims
- 0874US9257413B2Stack packages including diffusion barriers over sidewalls of through via electrodes and methods of manufacturing the sameSK HYNIX INC·Filed 2014·Granted Feb 9, 2016·4 cites·17 claims
- 0973US9570370B2Multi chip package and method for manufacturing the sameSK HYNIX INC·Filed 2014·Granted Feb 14, 2017·3 cites·5 claims
- 1073US8624241B2Semiconductor chip, stack-type semiconductor packageOH TAC KEUN·Filed 2011·Granted Jan 7, 2014·3 cites·14 claims
- 1169US8669642B2Semiconductor chip and fabricating method thereofSON HO YOUNG·Filed 2012·Granted Mar 11, 2014·2 cites·20 claims
- 1268US9508699B2Semiconductor package and method for manufacturing the sameSK HYNIX INC·Filed 2014·Granted Nov 29, 2016·2 cites·3 claims
- 1368US9406584B2Semiconductor package and method for manufacturing the sameSK HYNIX INC·Filed 2014·Granted Aug 2, 2016·2 cites·17 claims
- 1451US2013078807A1Wafer level chip scale package having an enhanced heat exchange efficiency with an emf shield and a method for fabricating the sameSK HYNIX INC·Filed 2012·Application pending·0 cites
- 1550US2009184414A1Wafer level chip scale package having an enhanced heat exchange efficiency with an emf shield and a method for fabricating the samePARK CHANG JUN·Filed 2008·Application pending·0 cites
- 1649US8338921B2Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the samePARK CHANG JUN·Filed 2011·Granted Dec 25, 2012·0 cites·3 claims
- 1748US2017287734A1Semiconductor packages including interposer and methods of manufacturing the sameSK HYNIX INC·Filed 2017·Application pending·0 cites
- 1847US2013154074A1Semiconductor stack packages and methods of fabricating the sameOH TAC KEUN·Filed 2012·Application pending·0 cites
- 1940US2014014958A1Semiconductor chip module and semiconductor package having the sameSK HYNIX INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →