Inventor · disambiguated record
Youngcheol Kim
Also filed as: KIM YOUNGCHEOL
21 granted patents·21 pending applications·108 citations·filing 2004–2025
93Inventor score
Files withSAMSUNG ELECTRONICS CO LTD15STATS CHIPPAC PTE LTD11STATS CHIPPAC LTD4CHIPPAC INC3KEYANG ELECTRIC MACHINERY CO LTD2
Top patents by PatentIndex Score
42 records- 0195US12362287B2Semiconductor device and method of making double shielding layers over the semiconductor deviceSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jul 15, 2025·2 cites·17 claims
- 0293US11735489B2Semiconductor device and method of forming hybrid TIM layersSTATS CHIPPAC PTE LTD·Filed 2021·Granted Aug 22, 2023·2 cites·25 claims
- 0393US11735530B2Semiconductor device and method of integrating RF antenna interposer with semiconductor packageSTATS CHIPPAC PTE LTD·Filed 2021·Granted Aug 22, 2023·2 cites·21 claims
- 0493US7253511B2Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array packageCHIPPAC INC·Filed 2004·Granted Aug 7, 2007·67 cites·44 claims
- 0591US7692279B2Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array packageCHIPPAC INC·Filed 2007·Granted Apr 6, 2010·18 cites·8 claims
- 0682US7829382B2Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array packageCHIPPAC INC·Filed 2010·Granted Nov 9, 2010·5 cites·20 claims
- 0778US9125332B2Filp chip interconnection structure with bump on partial pad and method thereofPENDSE RAJENDRA D·Filed 2010·Granted Sep 1, 2015·5 cites·27 claims
- 0877US12125764B2Semiconductor device and method of forming hybrid TIM layersSTATS CHIPPAC PTE LTD·Filed 2023·Granted Oct 22, 2024·0 cites·33 claims
- 0976US2025309137A1Semiconductor Device and Method of Double ShieldingSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 1075US12100663B2Semiconductor device and method of integrating RF antenna interposer with semiconductor packageSTATS CHIPPAC PTE LTD·Filed 2023·Granted Sep 24, 2024·0 cites·25 claims
- 1168US7875966B2Stacked integrated circuit and package systemSTATS CHIPPAC LTD·Filed 2005·Granted Jan 25, 2011·3 cites·5 claims
- 1267US8604602B2Integrated circuit packaging system with reinforced encapsulant having embedded interconnect and method of manufacture thereofCHOW SENG GUAN·Filed 2010·Granted Dec 10, 2013·2 cites·20 claims
- 1363US12009314B2Semiconductor device and method of compartment shielding using bond wiresSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jun 11, 2024·0 cites·28 claims
- 1462US2025343158A1Semiconductor Device and Method of Forming C2W Package with EMI ShieldingSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 1561US11770046B2Motor including tension memberKEYANG ELECTRIC MACHINERY CO LTD·Filed 2021·Granted Sep 26, 2023·0 cites·8 claims
- 1661US2025157958A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1759US2025338545A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1859US2025374581A1Manufacturing method of power semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1958US2025226311A1Power semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2058US2025261419A1Power semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2158US2025203954A1Power semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2258US2025259928A1Power semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2358US2025350229A1Power inverter, motor control device including the same and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2457US2025287640A1Power semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2557US2025234630A1Power semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2657US2025167135A1Semiconductor package including a stiffenerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2756US11450618B2Semiconductor device and method of compartment shielding using bond wiresSTATS CHIPPAC PTE LTD·Filed 2020·Granted Sep 20, 2022·0 cites·23 claims
- 2856US7759137B2Flip chip interconnection structure with bump on partial pad and method thereofSTATS CHIPPAC LTD·Filed 2008·Granted Jul 20, 2010·1 cites·19 claims
- 2956US2025212485A1Power semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3056US2025227954A1Power semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3153US12218114B2Semiconductor device and method of making a photonic semiconductor packageSTATS CHIPPAC PTE LTD·Filed 2021·Granted Feb 4, 2025·0 cites·13 claims
- 3253US2024021566A1Semiconductor Device and Method of Forming Underfill Dam for Chip-to-Wafer DeviceSTATS CHIPPAC PTE LTD·Filed 2022·Application pending·0 cites
- 3348US2025386543A1Power semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 3447US8410594B2Inter-stacking module systemHWANG KWANG SOON·Filed 2006·Granted Apr 2, 2013·1 cites·8 claims
- 3547US7947535B2Thin package system with external terminalsSTATS CHIPPAC LTD·Filed 2005·Granted May 24, 2011·0 cites·10 claims
- 3645US8841782B2Integrated circuit package system with mold gateYANG DAEWOOK·Filed 2008·Granted Sep 23, 2014·0 cites·20 claims
- 3744US8102043B2Stacked integrated circuit and package system and method for manufacturing thereofJEONG TAE SUNG·Filed 2011·Granted Jan 24, 2012·0 cites·13 claims
- 3844US2023179068A1Motor with fluxringKEYANG ELECTRIC MACHINERY CO LTD·Filed 2022·Application pending·0 cites
- 3943US2025261402A1Power semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 4041US8481371B2Thin package system with external terminals and method of manufacture thereofKIM YOUNGCHEOL·Filed 2011·Granted Jul 9, 2013·0 cites·20 claims
- 4139US2007268660A1Spacerless semiconductor package chip stacking systemSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
- 4232US2017361768A1Portable emergency sign device for vehicleKIM YOUNGCHEOL·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →