Inventor · disambiguated record
Viraj A. Patwardhan
Also filed as: PATWARDHAN VIRAJ · PATWARDHAN VIRAJ A · PATWARDHAN VIRAJ AJIT
18 granted patents·3 pending applications·328 citations·filing 2002–2021
95Inventor score
Files withNAT SEMICONDUCTOR CORP14INTUITIVE SURGICAL OPERATIONS3WIESE LYNN K2Intersil Americas LLC1KELKAR NIKHIL VISHWANATH1
Top patents by PatentIndex Score
21 records- 0196US7413927B1Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packagesNAT SEMICONDUCTOR CORP·Filed 2005·Granted Aug 19, 2008·44 cites·10 claims
- 0291US7838991B1Metallurgy for copper plated wafersNAT SEMICONDUCTOR CORP·Filed 2007·Granted Nov 23, 2010·16 cites·11 claims
- 0391US7301222B1Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packagesNAT SEMICONDUCTOR CORP·Filed 2003·Granted Nov 27, 2007·55 cites·7 claims
- 0489US8324602B2Optical sensors that reduce specular reflectionsWIESE LYNN K·Filed 2009·Granted Dec 4, 2012·23 cites·29 claims
- 0586US7375431B1Solder bump formation in electronics packagingNAT SEMICONDUCTOR CORP·Filed 2005·Granted May 20, 2008·12 cites·13 claims
- 0685US7135385B1Semiconductor devices having a back surface protective coatingNAT SEMICONDUCTOR CORP·Filed 2004·Granted Nov 14, 2006·43 cites·10 claims
- 0783US7253078B1Method and apparatus for forming an underfill adhesive layerNAT SEMICONDUCTOR CORP·Filed 2002·Granted Aug 7, 2007·31 cites·32 claims
- 0880US7095116B1Aluminum-free under bump metallization structureNAT SEMICONDUCTOR CORP·Filed 2003·Granted Aug 22, 2006·42 cites·18 claims
- 0979US7642175B1Semiconductor devices having a back surface protective coatingNAT SEMICONDUCTOR CORP·Filed 2006·Granted Jan 5, 2010·9 cites·6 claims
- 1073US8232541B2Optical sensors that reduce specular reflectionsWIESE LYNN K·Filed 2009·Granted Jul 31, 2012·6 cites·29 claims
- 1171US7674702B1Solder bump formation in electronics packagingNAT SEMICONDUCTOR CORP·Filed 2008·Granted Mar 9, 2010·4 cites·20 claims
- 1271US7015064B1Marking wafers using pigmentation in a mounting tapeNAT SEMICONDUCTOR CORP·Filed 2004·Granted Mar 21, 2006·17 cites·7 claims
- 1367US8946875B2Packaged semiconductor devices including pre-molded lead-frame structures, and related methods and systemsIntersil Americas LLC·Filed 2012·Granted Feb 3, 2015·2 cites·16 claims
- 1463US7423337B1Integrated circuit device package having a support coating for improved reliability during temperature cyclingNAT SEMICONDUCTOR CORP·Filed 2003·Granted Sep 9, 2008·11 cites·20 claims
- 1560US11206967B2Compact binocular image capture deviceINTUITIVE SURGICAL OPERATIONS·Filed 2020·Granted Dec 28, 2021·0 cites·19 claims
- 1660US7629246B2High strength solder joint formation method for wafer level packages and flip applicationsNAT SEMICONDUCTOR CORP·Filed 2007·Granted Dec 8, 2009·1 cites·16 claims
- 1760US6972244B1Marking semiconductor devices through a mount tapeNAT SEMICONDUCTOR CORP·Filed 2004·Granted Dec 6, 2005·12 cites·5 claims
- 1856US10575714B2Compact binocular image capture deviceINTUITIVE SURGICAL OPERATIONS·Filed 2017·Granted Mar 3, 2020·0 cites·20 claims
- 1952US2022151470A1Systems and methods for sealing a camera module of an endoscopic imaging instrumentINTUITIVE SURGICAL OPERATIONS·Filed 2021·Application pending·0 cites
- 2047US2011024910A1Metallurgy for copper plated wafersNAT SEMICONDUCTOR CORP·Filed 2010·Application pending·0 cites
- 2137US2012290255A1Clear layer isolationKELKAR NIKHIL VISHWANATH·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →