Inventor · disambiguated record
You-Ming Hsu
Also filed as: HSU YOU-MING
11 granted patents·1 pending application·24 citations·filing 2009–2022
84Inventor score
Top patents by PatentIndex Score
12 records- 0185US8347490B1Method for fabricating a carrier with a three dimensional inductorCHIPBOND TECHNOLOGY CORP·Filed 2011·Granted Jan 8, 2013·7 cites·8 claims
- 0284US8432017B2Method for fabricating a three-dimensional inductor carrier with metal core and structure thereofKUO CHIH-MING·Filed 2011·Granted Apr 30, 2013·8 cites·13 claims
- 0381US11651974B2Semiconductor package and method of fabricating the sameCHIPBOND TECHNOLOGY CORP·Filed 2021·Granted May 16, 2023·1 cites·7 claims
- 0469US8981536B1Semiconductor structureCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Mar 17, 2015·3 cites·6 claims
- 0567US8513772B2Method for fabricating a three-dimensional inductor carrier with metal core and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Aug 20, 2013·2 cites·12 claims
- 0665US8367018B2Chip with tri-layer electrode and micro-cavity arrays for control of bioparticle and manufacturing method thereofUNIV SOUTHERN TAIWAN TECH·Filed 2009·Granted Feb 5, 2013·3 cites·4 claims
- 0764US2022336233A1Semiconductor package and method of fabricating the sameCHIPBOND TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 0860US12424551B2Semiconductor structure and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2022·Granted Sep 23, 2025·0 cites·10 claims
- 0954US8963675B2Method for fabricating a carrier with a three dimensional inductor and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2012·Granted Feb 24, 2015·0 cites·2 claims
- 1041US9000569B2Semiconductor structureCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Apr 7, 2015·0 cites·7 claims
- 1140US8796824B1Semiconductor structureCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Aug 5, 2014·0 cites·15 claims
- 1240US8772644B2Carrier with three-dimensional capacitorCHIPBOND TECHNOLOGY CORP·Filed 2012·Granted Jul 8, 2014·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →