Inventor · disambiguated record
Michael Connell
Also filed as: CONNELL MICHAEL · CONNELL MICHAEL E
23 granted patents·7 pending applications·500 citations·filing 1999–2024
96Inventor score
Files withMICRON TECHNOLOGY INC16ASSA ABLOY ACCESS & DOOR CONTROLS GROUP INC9APTINA IMAGING CORP1ROCKWOOD MFG COMPANY1SOUTH DAKOTA SCHOOL OF MINES A1
Top patents by PatentIndex Score
30 records- 0194US7115853B2Micro-lens configuration for small lens focusing in digital imaging devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 3, 2006·67 cites·25 claims
- 0293US7557337B2Micro-lens configuration for small lens focusing in digital imaging devicesAPTINA IMAGING CORP·Filed 2005·Granted Jul 7, 2009·18 cites·25 claims
- 0392US6896760B1Fabrication of stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2002·Granted May 24, 2005·51 cites·23 claims
- 0491US7169685B2Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesiveMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 30, 2007·53 cites·74 claims
- 0590US7037756B1Stacked microelectronic devices and methods of fabricating sameMICRON TECHNOLOGY INC·Filed 2003·Granted May 2, 2006·51 cites·38 claims
- 0690US7001795B2Total internal reflection (TIR) CMOS imagerMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 21, 2006·47 cites·63 claims
- 0789US6762074B1Method and apparatus for forming thin microelectronic diesMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 13, 2004·55 cites·49 claims
- 0888US7727785B2Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesiveMICRON TECHNOLOGY INC·Filed 2005·Granted Jun 1, 2010·13 cites·23 claims
- 0988US7022418B2Fabrication of stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2004·Granted Apr 4, 2006·32 cites·23 claims
- 1087US7405385B2Micro-lens configuration for small lens focusing in digital imaging devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 29, 2008·8 cites·17 claims
- 1185US7037751B2Fabrication of stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2004·Granted May 2, 2006·26 cites·10 claims
- 1280US6514795B1Packaged stacked semiconductor die and method of preparing sameMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 4, 2003·25 cites·24 claims
- 1374US6894380B2Packaged stacked semiconductor die and method of preparing sameMICRON TECHNOLOGY INC·Filed 2002·Granted May 17, 2005·17 cites·18 claims
- 1468US7297412B2Fabrication of stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Nov 20, 2007·2 cites·22 claims
- 1567US11214996B2Retrofit latch adapterASSA ABLOY ACCESS & DOOR CONTROLS GROUP INC·Filed 2019·Granted Jan 4, 2022·2 cites·18 claims
- 1667US10704298B2Panic exit device and door handleASSA ABLOY ACCESS & DOOR CONTROLS GROUP INC·Filed 2017·Granted Jul 7, 2020·2 cites·21 claims
- 1765US6995442B2Total internal reflection (TIR) CMOS imagerMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 7, 2006·9 cites·40 claims
- 1859US6882036B2Apparatuses for forming thin microelectronic diesMICRON TECHNOLOGY INC·Filed 2004·Granted Apr 19, 2005·8 cites·12 claims
- 1954US2025163729A1Dogging mechanism for exit devicesASSA ABLOY ACCESS & DOOR CONTROLS GROUP INC·Filed 2024·Application pending·0 cites
- 2051US11905733B2Dampener for an exit deviceASSA ABLOY ACCESS & DOOR CONTROLS GROUP INC·Filed 2020·Granted Feb 20, 2024·0 cites·19 claims
- 2151US2006172510A1Fabrication of stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 2247US2023332437A1Locking pull handle dogging mechanismASSA ABLOY ACCESS & DOOR CONTROLS GROUP INC·Filed 2023·Application pending·0 cites
- 2346US2022154489A1Door pullASSA ABLOY ACCESS & DOOR CONTROLS GROUP INC·Filed 2021·Application pending·0 cites
- 2445USD922173SDoor handleASSA ABLOY ACCESS & DOOR CONTROLS GROUP INC·Filed 2019·Granted Jun 15, 2021·4 cites·1 claims
- 2542US2004104491A1Wafer back side coating to balance stress from passivation layer on front of wafer and be used as a die attach adhesiveFiled 2003·Application pending·0 cites
- 2641US6198861B1Method of using thin-clad near infrared transparent optical glass fibers as evanescent wave sensorsSOUTH DAKOTA SCHOOL OF MINES A·Filed 1999·Granted Mar 6, 2001·9 cites·15 claims
- 2739US2003042615A1Stacked microelectronic devices and methods of fabricating sameFiled 2001·Application pending·0 cites
- 2835USD936446SExit deviceASSA ABLOY ACCESS & DOOR CONTROLS GROUP INC·Filed 2016·Granted Nov 23, 2021·1 cites·1 claims
- 2935US2017365114A1Integrated card readerROCKWOOD MFG COMPANY·Filed 2017·Application pending·0 cites
- 3032USD906082SCombined exit device and doorASSA ABLOY ACCESS & DOOR CONTROLS GROUP INC·Filed 2019·Granted Dec 29, 2020·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →