Inventor · disambiguated record
Syo Fukata
Also filed as: FUKATA SYO
9 granted patents·1 pending application·70 citations·filing 2012–2021
86Inventor score
Top patents by PatentIndex Score
10 records- 0195US11935784B2Three-dimensional memory device containing self-aligned bit line contacts and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Mar 19, 2024·4 cites·20 claims
- 0295US8828884B2Multi-level contact to a 3D memory array and method of makingLEE YAO-SHENG·Filed 2012·Granted Sep 9, 2014·35 cites·14 claims
- 0392US9305935B2Multi-level contact to a 3D memory array and method of makingSANDISK TECHNOLOGIES INC·Filed 2015·Granted Apr 5, 2016·9 cites·20 claims
- 0490US9978768B2Method of making three-dimensional semiconductor memory device having laterally undulating memory filmsSANDISK TECHNOLOGIES LLC·Filed 2016·Granted May 22, 2018·9 cites·19 claims
- 0588US8994099B2Multi-level contact to a 3D memory array and method of makingSANDISK TECHNOLOGIES INC·Filed 2014·Granted Mar 31, 2015·8 cites·6 claims
- 0685US10847376B2In-situ deposition and etch process and apparatus for precision patterning of semiconductor devicesSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Nov 24, 2020·4 cites·16 claims
- 0779US11598005B2Deposition apparatus including an off-axis lift-and-rotation unit and methods for operating the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Mar 7, 2023·1 cites·13 claims
- 0846US11551961B2Multi-zone plasma-enhanced chemical vapor deposition apparatus and methods for operating the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Jan 10, 2023·0 cites·20 claims
- 0946US11538708B2Multi-zone plasma-enhanced chemical vapor deposition apparatus and methods for operating the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Dec 27, 2022·0 cites·20 claims
- 1044US2021391154A1Anisotropic etch apparatus with local etch direction adjustment capability and methods for operating the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →