Inventor · disambiguated record
Charley T. Ogata
Also filed as: OGATA CHARLEY · OGATA CHARLEY T · OGATA CHARLEY TAKESHI
17 granted patents·4 pending applications·241 citations·filing 2001–2020
94Inventor score
Top patents by PatentIndex Score
21 records- 0198US9665200B2Temperature compensating transparent force sensorAPPLE INC·Filed 2015·Granted May 30, 2017·27 cites·18 claims
- 0298US9542028B2Temperature compensating transparent force sensor having a compliant layerAPPLE INC·Filed 2015·Granted Jan 10, 2017·61 cites·13 claims
- 0397US9690413B2Temperature compensating transparent force sensor having a compliant layerAPPLE INC·Filed 2015·Granted Jun 27, 2017·24 cites·22 claims
- 0496US10048789B2Force determination employing sheet sensor and capacitive arrayAPPLE INC·Filed 2015·Granted Aug 14, 2018·18 cites·20 claims
- 0593US10423265B2Temperature compensating force sensorAPPLE INC·Filed 2017·Granted Sep 24, 2019·7 cites·20 claims
- 0693US10379657B2Force determination employing sheet sensor and capacitive arrayAPPLE INC·Filed 2018·Granted Aug 13, 2019·7 cites·20 claims
- 0791US10739899B2Force determination employing sheet sensorAPPLE INC·Filed 2019·Granted Aug 11, 2020·5 cites·10 claims
- 0889US10168814B2Force sensing based on capacitance changesAPPLE INC·Filed 2013·Granted Jan 1, 2019·12 cites·16 claims
- 0988US10162444B2Force sensor incorporated into displayAPPLE INC·Filed 2015·Granted Dec 25, 2018·5 cites·6 claims
- 1085US10019085B2Sensor layer having a patterned compliant layerAPPLE INC·Filed 2016·Granted Jul 10, 2018·5 cites·16 claims
- 1183US10466829B2Temperature compensating sensor having a compliant layer separating independent force sensing substrates and sense circuitry to obtain a relative measure between the force sensing substratesAPPLE INC·Filed 2017·Granted Nov 5, 2019·2 cites·14 claims
- 1283US7123465B2Decoupling capacitor for an integrated circuit and method of manufacturing thereofSILICON BANDWIDTH INC·Filed 2004·Granted Oct 17, 2006·30 cites·21 claims
- 1372US6797882B1Die package for connection to a substrateSILICON BANDWIDTH INC·Filed 2001·Granted Sep 28, 2004·16 cites·29 claims
- 1465US7253365B2Die package for connection to a substrateQUANTUM LEAP PACKAGING INC·Filed 2004·Granted Aug 7, 2007·11 cites·25 claims
- 1558US6803650B2Semiconductor die package having mesh power and ground planesSILICON BANDWIDTH INC·Filed 2001·Granted Oct 12, 2004·11 cites·26 claims
- 1657US11635334B2Miniature external temperature sensing device for estimating subsurface tissue temperaturesAPPLE INC·Filed 2020·Granted Apr 25, 2023·0 cites·19 claims
- 1755US2016103544A1Force Determination Employing Sheet Sensor and Capacitive ArrayAPPLE INC·Filed 2015·Application pending·0 cites
- 1851US10817096B2Force sensor incorporated into displayAPPLE INC·Filed 2015·Granted Oct 27, 2020·0 cites·25 claims
- 1945US2013300978A1Display with Minimized Light LeakageAPPLE INC·Filed 2012·Application pending·0 cites
- 2042US2006279904A1Decoupling capacitor for an integrated circuit and method of manufacturing thereofSILICON BANDWIDTH INC·Filed 2006·Application pending·0 cites
- 2139US2004222514A1Semiconductor die package having mesh power and ground planesSILICON BANDWIDTH INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →