Inventor · disambiguated record
Stephen A. Murphy
Also filed as: MURPHY STEPHEN · MURPHY STEPHEN A
5 granted patents·6 pending applications·109 citations·filing 1997–2014
80Inventor score
Top patents by PatentIndex Score
11 records- 0185US5998242AVacuum assisted underfill process and apparatus for semiconductor package fabricationLSI LOGIC CORP·Filed 1997·Granted Dec 7, 1999·90 cites·23 claims
- 0280US9711438B2Semiconductor device and method of forming a dual UBM structure for lead free bump connectionsSTATS CHIPPAC LTD·Filed 2014·Granted Jul 18, 2017·5 cites·5 claims
- 0376US8759209B2Semiconductor device and method of forming a dual UBM structure for lead free bump connectionsLIN LI-JEN·Filed 2011·Granted Jun 24, 2014·6 cites·30 claims
- 0474US8309451B2Semiconductor device and method of providing common voltage bus and wire bondable redistributionDO BYUNG TAI·Filed 2008·Granted Nov 13, 2012·5 cites·21 claims
- 0562US10649619B2System and method of using context in selecting a response to user device interactionOATH INC·Filed 2013·Granted May 12, 2020·3 cites·39 claims
- 0655US2015039354A1Self-service system and method of tagging baggageNCR CORP·Filed 2013·Application pending·0 cites
- 0753US2009250814A1Flip Chip Interconnection Structure Having Void-Free Fine Pitch and Method ThereofSTATS CHIPPAC LTD·Filed 2008·Application pending·0 cites
- 0850US2009178727A1Combination water conservation apparatus and watering bucket with method of useMURPHY STEPHEN A·Filed 2008·Application pending·0 cites
- 0949US2010117230A1Flip Chip Interconnection Structure Having Void-Free Fine Pitch and Method ThereofSTATS CHIPPAC LTD·Filed 2010·Application pending·0 cites
- 1048US2012261817A1Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable RedistributionDO BYUNG TAI·Filed 2012·Application pending·0 cites
- 1135US2012041583A1Measurement system and methodCONLEY JOSHUA·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Stephen A. Murphy files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →