Inventor · disambiguated record
Masud Beroz
Also filed as: BEROZ MASUD
77 granted patents·26 pending applications·2,498 citations·filing 1995–2019
99Inventor score
Top patents by PatentIndex Score
103 records- 0198US9153562B2Stacked packaging improvementsTESSERA INC·Filed 2014·Granted Oct 6, 2015·60 cites·17 claims
- 0298US8927337B2Stacked packaging improvementsTESSERA INC·Filed 2013·Granted Jan 6, 2015·76 cites·18 claims
- 0398US8525314B2Stacked packaging improvementsHABA BELGACEM·Filed 2005·Granted Sep 3, 2013·98 cites·6 claims
- 0498US8329581B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2011·Granted Dec 11, 2012·45 cites·17 claims
- 0598US7453157B2Microelectronic packages and methods thereforTESSERA INC·Filed 2005·Granted Nov 18, 2008·101 cites·36 claims
- 0698US7176506B2High frequency chip packages with connecting elementsTESSERA INC·Filed 2003·Granted Feb 13, 2007·320 cites·18 claims
- 0797US8946757B2Heat spreading substrate with embedded interconnectsMOHAMMED ILYAS·Filed 2012·Granted Feb 3, 2015·41 cites·16 claims
- 0896US6329605B1Components with conductive solder mask layersTESSERA INC·Filed 1999·Granted Dec 11, 2001·180 cites·11 claims
- 0995US7745943B2Microelectonic packages and methods thereforTESSERA INC·Filed 2007·Granted Jun 29, 2010·32 cites·29 claims
- 1095US7462936B2Formation of circuitry with modification of feature heightTESSERA INC·Filed 2004·Granted Dec 9, 2008·84 cites·21 claims
- 1195US6543131B1Microelectronic joining processes with temporary securementTESSERA INC·Filed 2000·Granted Apr 8, 2003·49 cites·13 claims
- 1294US8207604B2Microelectronic package comprising offset conductive posts on compliant layerHABA BELGACEM·Filed 2004·Granted Jun 26, 2012·93 cites·20 claims
- 1394US6848173B2Microelectric packages having deformed bonded leads and methods thereforTESSERA INC·Filed 2001·Granted Feb 1, 2005·82 cites·22 claims
- 1492US7268426B2High-frequency chip packagesTESSERA INC·Filed 2004·Granted Sep 11, 2007·56 cites·18 claims
- 1592US7176043B2Microelectronic packages and methods thereforTESSERA INC·Filed 2004·Granted Feb 13, 2007·69 cites·54 claims
- 1691US7989940B2System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through aperturesTESSERA INC·Filed 2004·Granted Aug 2, 2011·63 cites·10 claims
- 1791US7793414B2Methods for forming connection structures for microelectronic devicesTESSERA INC·Filed 2006·Granted Sep 14, 2010·18 cites·22 claims
- 1891US7012323B2Microelectronic assemblies incorporating inductorsTESSERA INC·Filed 2003·Granted Mar 14, 2006·47 cites·20 claims
- 1990US6940158B2Assemblies having stacked semiconductor chips and methods of making sameTESSERA INC·Filed 2003·Granted Sep 6, 2005·52 cites·18 claims
- 2089US8975616B2Quantum efficiency of multiple quantum wellsWANG LIANG·Filed 2012·Granted Mar 10, 2015·7 cites·18 claims
- 2189US6461892B2Methods of making a connection component using a removable layerTESSERA INC·Filed 2001·Granted Oct 8, 2002·46 cites·82 claims
- 2289US6384475B1Lead formation using gridsTESSERA INC·Filed 2000·Granted May 7, 2002·51 cites·12 claims
- 2389US6338982B1Enhancements in framed sheet processingTESSERA INC·Filed 2000·Granted Jan 15, 2002·38 cites·9 claims
- 2489US6217972B1Enhancements in framed sheet processingTESSERA INC·Filed 1998·Granted Apr 17, 2001·80 cites·7 claims
- 2588US10128601B1Fluid pressure activated electrical contact devices and methodsCOMPONENTZEE LLC·Filed 2018·Granted Nov 13, 2018·3 cites·26 claims
- 2688US6651321B2Microelectronic joining processesTESSERA INC·Filed 2000·Granted Nov 25, 2003·27 cites·13 claims
- 2788US6214640B1Method of manufacturing a plurality of semiconductor packagesTESSERA INC·Filed 1999·Granted Apr 10, 2001·119 cites·26 claims
- 2888US6188028B1Multilayer structure with interlocking protrusionsTESSERA INC·Filed 1998·Granted Feb 13, 2001·69 cites·81 claims
- 2986US9805891B2Multiplexing, switching and testing devices and methods using fluid pressureCOMPONENTZEE LLC·Filed 2015·Granted Oct 31, 2017·4 cites·20 claims
- 3085US9842745B2Heat spreading substrate with embedded interconnectsINVENSAS CORP·Filed 2015·Granted Dec 12, 2017·4 cites·11 claims
- 3185US6737265B2Microelectronic unit forming methods and materialsTESSERA INC·Filed 2002·Granted May 18, 2004·29 cites·50 claims
- 3285US6541852B2Framed sheetsTESSERA INC·Filed 2001·Granted Apr 1, 2003·32 cites·16 claims
- 3384US8900974B2High yield substrate assemblyWANG LIANG·Filed 2012·Granted Dec 2, 2014·4 cites·21 claims
- 3484US7999397B2Microelectronic packages and methods thereforTESSERA INC·Filed 2010·Granted Aug 16, 2011·5 cites·17 claims
- 3584US7288433B2Method of making assemblies having stacked semiconductor chipsTESSERA INC·Filed 2005·Granted Oct 30, 2007·11 cites·7 claims
- 3684US7152311B2Enhancements in framed sheet processingTESSERA INC·Filed 2001·Granted Dec 26, 2006·25 cites·12 claims
- 3781US7554206B2Microelectronic packages and methods thereforTESSERA INC·Filed 2006·Granted Jun 30, 2009·9 cites·13 claims
- 3881US6873039B2Methods of making microelectronic packages including electrically and/or thermally conductive elementTESSERA INC·Filed 2003·Granted Mar 29, 2005·29 cites·7 claims
- 3981US6361959B1Microelectronic unit forming methods and materialsTESSERA INC·Filed 1999·Granted Mar 26, 2002·65 cites·81 claims
- 4081US6228685B1Framed sheet processingTESSERA INC·Filed 1998·Granted May 8, 2001·48 cites·18 claims
- 4180US7351641B2Structure and method of forming capped chipsTESSERA INC·Filed 2005·Granted Apr 1, 2008·11 cites·18 claims
- 4279US9577358B2Fluid pressure activated electrical contact devices and methodsCOMPONENTZEE LLC·Filed 2015·Granted Feb 21, 2017·5 cites·20 claims
- 4379US8963013B2Three dimensional interposer deviceBEROZ MASUD·Filed 2011·Granted Feb 24, 2015·7 cites·23 claims
- 4478US7816251B2Formation of circuitry with modification of feature heightTESSERA INC·Filed 2008·Granted Oct 19, 2010·6 cites·15 claims
- 4577US8841204B2High yield substrate assemblyWANG LIANG·Filed 2013·Granted Sep 23, 2014·2 cites·19 claims
- 4677US8531020B2Stacked packaging improvementsHABA BELGACEM·Filed 2010·Granted Sep 10, 2013·2 cites·7 claims
- 4777US6063648ALead formation usings gridsTESSERA INC·Filed 1998·Granted May 16, 2000·44 cites·14 claims
- 4871US7427423B2Components with conductive solder mask layersTESSERA INC·Filed 2001·Granted Sep 23, 2008·15 cites·4 claims
- 4970US9293641B2Inverted optical deviceMOHAMMED ILYAS·Filed 2011·Granted Mar 22, 2016·2 cites·23 claims
- 5069US9583671B2Quantum efficiency of multiple quantum wellsINVENSAS CORP·Filed 2015·Granted Feb 28, 2017·1 cites·14 claims
Showing the top 50 of 103 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →