Inventor · disambiguated record
Bruno Geoffrion
Also filed as: GEOFFRION BRUNO
13 granted patents·2 pending applications·733 citations·filing 2002–2007
93Inventor score
Top patents by PatentIndex Score
15 records- 0198US8231799B2Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zoneBERA KALLOL·Filed 2006·Granted Jul 31, 2012·557 cites·18 claims
- 0295US7846497B2Method and apparatus for controlling gas flow to a processing chamberAPPLIED MATERIALS INC·Filed 2007·Granted Dec 7, 2010·37 cites·21 claims
- 0394US7722737B2Gas distribution system for improved transient phase depositionAPPLIED MATERIALS INC·Filed 2005·Granted May 25, 2010·23 cites·10 claims
- 0493US7775236B2Method and apparatus for controlling gas flow to a processing chamberAPPLIED MATERIALS INC·Filed 2007·Granted Aug 17, 2010·25 cites·20 claims
- 0590US7431859B2Plasma etch process using polymerizing etch gases with different etch and polymer-deposition rates in different radial gas injection zones with time modulationAPPLIED MATERIALS INC·Filed 2006·Granted Oct 7, 2008·18 cites·16 claims
- 0689US7540971B2Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas contentAPPLIED MATERIALS INC·Filed 2006·Granted Jun 2, 2009·16 cites·19 claims
- 0787US8074677B2Method and apparatus for controlling gas flow to a processing chamberGOLD EZRA ROBERT·Filed 2007·Granted Dec 13, 2011·19 cites·20 claims
- 0887US7541292B2Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zonesAPPLIED MATERIALS INC·Filed 2006·Granted Jun 2, 2009·12 cites·21 claims
- 0972US6812153B2Method for high aspect ratio HDP CVD gapfillAPPLIED MATERIALS INC·Filed 2002·Granted Nov 2, 2004·13 cites·7 claims
- 1071US7189639B2Use of germanium dioxide and/or alloys of GeO2 with silicon dioxide for semiconductor dielectric applicationsAPPLIED MATERIALS INC·Filed 2005·Granted Mar 13, 2007·3 cites·32 claims
- 1164US6890597B2HDP-CVD uniformity controlAPPLIED MATERIALS INC·Filed 2003·Granted May 10, 2005·6 cites·22 claims
- 1262US2008041821A1Gas Distribution System for Improved Transient Phase DepositionAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 1350US7064077B2Method for high aspect ratio HDP CVD gapfillAPPLIED MATERIALS INC·Filed 2004·Granted Jun 20, 2006·2 cites·20 claims
- 1444US9405298B2System and method to divide fluid flow in a predetermined ratioGEOFFRION BRUNO·Filed 2006·Granted Aug 2, 2016·2 cites·6 claims
- 1543US2007254483A1Plasma etch process using polymerizing etch gases and an inert diluent gas in independent gas injection zones to improve etch profile or etch rate uniformityAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →