Inventor · disambiguated record
Seung Seoup Lee
Also filed as: LEE SEUNG SEOUP
18 granted patents·9 pending applications·138 citations·filing 2008–2014
91Inventor score
Top patents by PatentIndex Score
27 records- 0195US8666126B2Fingerprint detection sensor and method of detecting fingerprintLEE SEUNG SEOUP·Filed 2012·Granted Mar 4, 2014·93 cites·9 claims
- 0294US8736139B2Optical image stabilizer and method of manufacturing the sameLEE SEUNG SEOUP·Filed 2010·Granted May 27, 2014·25 cites·10 claims
- 0384US9128350B1Micro-iris unit and camera module including the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Sep 8, 2015·5 cites·20 claims
- 0472US8410465B2Apparatus and method for inspecting defects of a circuit pattern formed on a substrate using a laser and a non-contact capacitor sensorLEE SEUNG SEOUP·Filed 2010·Granted Apr 2, 2013·3 cites·14 claims
- 0571US7982982B2Wafer level packaging image sensor module having lens actuator and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Granted Jul 19, 2011·2 cites·4 claims
- 0668US9153641B2Wafer level package having cylindrical capacitor and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 6, 2015·2 cites·6 claims
- 0768US8656582B2Method of attaching die using self-assembling monolayer and package substrate including die attached thereto using self-assembling monolayerLEE SEUNG SEOUP·Filed 2009·Granted Feb 25, 2014·4 cites·11 claims
- 0864US8111389B2Method of inspecting defects in circuit pattern of substrateLEE SEUNG SEOUP·Filed 2010·Granted Feb 7, 2012·2 cites·4 claims
- 0962US8283251B2Method of manufacturing wafer level packageLEE SEUNG SEOUP·Filed 2011·Granted Oct 9, 2012·1 cites·4 claims
- 1061US8378452B2Wafer level package having cylindrical capacitor and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2010·Granted Feb 19, 2013·1 cites·3 claims
- 1159US9502464B2Method of manufacturing optical image stabilizerSAMSUNG ELECTRO MECH·Filed 2014·Granted Nov 22, 2016·0 cites·3 claims
- 1258US8921146B2Method for manufacturing optical image stabilizer employing scratch drive actuatorSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 30, 2014·0 cites·7 claims
- 1356US2014073078A1Device for converting energy and method for manufacturing the device, and electronic apparatus with the deviceSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1452US8593532B2Optical image stabilizer employing a scratch drive actuatorLEE SEUNG SEOUP·Filed 2010·Granted Nov 26, 2013·0 cites·12 claims
- 1552US2009309177A1Wafer level camera module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1651US2010187677A1Wafer level package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1751US2010052164A1Wafer level package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1849US8614391B2Device for converting energy and method for manufacturing the device, and electronic apparatus with the deviceLEE SEUNG SEOUP·Filed 2010·Granted Dec 24, 2013·0 cites·8 claims
- 1945US2011281430A1Wafer level package and method of manufacturing the sameLEE SEUNG-SEOUP·Filed 2011·Application pending·0 cites
- 2044US9060734B2Fixed focus transducer array and ultrasonic wave transceiving apparatus using the sameLEE SEUNG SEOUP·Filed 2012·Granted Jun 23, 2015·0 cites·12 claims
- 2144US8624618B2Apparatus and method for inspecting circuit of substrateLEE SEUNG SEOUP·Filed 2010·Granted Jan 7, 2014·0 cites·21 claims
- 2242US2013121681A1Camera moduleLEE SEUNG SEOUP·Filed 2012·Application pending·0 cites
- 2341US2012315578A1Apparatus and method for spin-coating, and method for manufacturing substrate having structureLEE SEUNG SEOUP·Filed 2012·Application pending·0 cites
- 2440US2013133428A1Fingerprint detection sensor and method of manufacturing the sameLEE SEUNG SEOUP·Filed 2012·Application pending·0 cites
- 2539US9331070B2Variable capacitor and integrated circuit including the sameSAMSUNG ELECTRO MECH·Filed 2012·Granted May 3, 2016·0 cites·23 claims
- 2638US8471581B2Apparatus and method for inspecting defects in circuit pattern of substrateLEE SEUNG SEOUP·Filed 2010·Granted Jun 25, 2013·0 cites·8 claims
- 2732US2013129163A1Fingerprint sensor and method of operating the sameCHUNG IL KWON·Filed 2012·Application pending·0 cites
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