Wafer level package and method of manufacturing the same

Abstract

The present invention relates to a wafer level package and a method of manufacturing the same and provides a wafer level package structure including a wafer having a die pad; a redistribution line formed to be connected on a top surface of the die pad; a metal post connected to a top surface of the redistribution line and formed in a flexure hinge structure; and a molding resin formed between the metal posts.

1 . wafer level package comprising:
 a wafer including a die pad;   a redistribution line formed to be connected on a top surface of the die pad;   a metal post connected to a top surface of the redistribution line and formed in a flexure hinge structure; and   a molding resin formed between the metal posts.   
     
     
         2 . The wafer level package according to  claim 1 , wherein the flexure hinge structure of the metal post includes a concave central portion. 
     
     
         3 . The wafer level package according to  claim 1 , wherein the flexure hinge structure of the metal post includes a curved side surface and is spread upward. 
     
     
         4 . The wafer level package according to  claim 1 , further comprising:
 a protection layer which is formed between the wafer and the redistribution line and includes a via hole to expose a portion of a top surface of the die pad.   
     
     
         5 . The wafer level package according to  claim 1 , further comprising:
 an external connection device formed at a top surface of the metal post.   
     
     
         6 . The wafer level package according to  claim 5 , wherein the external connection device is a solder ball. 
     
     
         7 . A method for manufacturing a wafer level package comprising:
 forming a redistribution line connected to a top surface of a die pad on a wafer with the die pad;   additionally preparing a carrier film including a metal post with a concave central portion on one surface;   bonding the metal post to a top surface of the redistribution line;   molding a space between the metal posts with a molding resin; and   removing the carrier film.   
     
     
         8 . The method according to  claim 7 , wherein the additionally preparing the carrier film including the metal post with the concave central portion includes:
 separately preparing a first silicon substrate and a second silicon substrate;   separately forming first and second metal post filling spaces which include curved side surfaces and are spread upward by etching portions of the first and second silicon substrates;   forming a silicon mold with a metal post filling space of which a central portion is concave by bonding the first silicon substrate to the second silicon substrate to contact bottom surfaces thereof to each other;   adhering a carrier film coated with metal to one surface of the silicon mold;   forming a metal post by plating the metal post filling space of the silicon mold with metal; and   selectively removing the silicon mold.   
     
     
         9 . The method according to  claim 8 , wherein in the separately forming the first and second metal post filling spaces which include the curved side surfaces and are spread upward by etching the portions of the first and second silicon substrates,
 the first and second silicon substrates are etched by an RIE(Reactive Ion Etching) method.   
     
     
         10 . The method according to  claim 7 , before forming the redistribution line, further comprising:
 forming a protection layer including a via hole to expose a portion of a top surface of a die pad on a wafer with the die pad.   
     
     
         11 . The method according to  claim 7 , after removing the carrier film, further comprising:
 forming an external connection device on a top surface of the metal post.   
     
     
         12 . A method for manufacturing a wafer level package comprising:
 forming a redistribution line connected to a top surface of a die pad on a wafer with the die pad;   forming a molding resin with a metal post filling space, which exposes a portion of a top surface of the redistribution line, includes a curved side surface, and is spread upward, on an upper part of the wafer including the redistribution line; and   forming a metal post by plating the metal post filling space with metal.   
     
     
         13 . The method according to  claim 12 , wherein the forming the molding resin with the metal post filling space includes:
 forming the molding resin on the entire surface of the wafer including the redistribution line; and   imprinting the molding resin by using a mold provided with an uneven portion of the same shape as that of the metal post filling space on the surface.