US2014073078A1PendingUtilityA1

Device for converting energy and method for manufacturing the device, and electronic apparatus with the device

Assignee: SAMSUNG ELECTRO MECHPriority: May 25, 2010Filed: Nov 12, 2013Published: Mar 13, 2014
Est. expiryMay 25, 2030(~3.8 yrs left)· nominal 20-yr term from priority
Inventors:Seung Seoup Lee
H10N 10/01H10N 10/17H01L 35/34
56
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Claims

Abstract

The present invention provides an energy converting device, which includes: a base substrate; and a plurality of thermoelectric element structures which are sequentially stacked on the base substrate and electrically interconnected in parallel to one another.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method for manufacturing an energy converting device comprising the steps of:
 preparing a base substrate; and   forming thermoelectric element structures which are stacked on top of each other in the same configuration with respect to each of the thermoelectric element structures and are electrically interconnected in parallel to one another.   
     
     
         2 . The method of  claim 1 , wherein the step of forming the thermoelectric element structures comprises the steps of:
 forming an N-type electrode above an edge of one side of the base substrate;   forming a P-type electrode above an edge of the other side of the base substrate;   an N-type thermoelectric pattern which extends toward the P-type electrode from the N-type electrode in a parallel relation with respect to the base substrate; and   a P-type thermoelectric pattern which extends toward the N-type electrode from the P-type electrode in a parallel relation with respect to the base substrate;   a conductor which is interposed between the P-type thermoelectric pattern and the N-type thermoelectric pattern.   
     
     
         3 . The method of  claim 1 , wherein the step of forming the thermoelectric element structures comprises the steps of:
 forming the thermoelectric element structures;   forming the N-type electrode which is disposed above an edge of one side of the base substrate in a perpendicular direction to the base substrate; and   forming the P-type electrode which is disposed above an edge of the other side of the base substrate in a perpendicular direction to the base substrate,   wherein the step of forming the N-type and P-type electrodes comprises a step of stacking a plurality of conductive films on the base substrate.   
     
     
         4 . The method of  claim 1 , further comprising a step of forming an external connection unit which covers the uppermost thermoelectric element structure among the thermoelectric element structures,
 wherein the step of forming the external connection unit comprises the steps of:   forming a protective film with grooves which can expose the N-type and P-type electrodes, on the uppermost thermoelectric element structure among the thermoelectric element structures; and   forming electrode pads which cover the grooves and are electrically connected to the N-type and P-type electrodes.

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