Inventor · disambiguated record
Jung Eun Kang
Also filed as: KANG JUNG EUN
4 granted patents·9 pending applications·15 citations·filing 2009–2013
68Inventor score
Top patents by PatentIndex Score
13 records- 0182US8198543B2Rigid-flexible circuit board and method of manufacturing the sameKANG JUNG EUN·Filed 2009·Granted Jun 12, 2012·12 cites·17 claims
- 0265US8315056B2Heat-radiating substrate and method of manufacturing the sameLIM CHANG HYUN·Filed 2010·Granted Nov 20, 2012·1 cites·10 claims
- 0363US8338714B2Heat-radiating substrate and manufacturing method thereofKANG JUNG EUN·Filed 2010·Granted Dec 25, 2012·2 cites·19 claims
- 0459US9107313B2Method of manufacturing a hybrid heat-radiating substrateSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 11, 2015·0 cites·5 claims
- 0554US2013042963A1Heat-radiating substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 0649US2011303440A1Hybrid heat-radiating substrate and method of manufacturing the sameLIM CHANG HYUN·Filed 2010·Application pending·0 cites
- 0741US2014084447A1Power module packageSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0841US2011303437A1Heat-radiating substrate and method of manufacturing the sameLIM CHANG HYUN·Filed 2010·Application pending·0 cites
- 0940US2012073863A1Anodized heat-radiating substrate and method of manufacturing the sameKANG JUNG EUN·Filed 2011·Application pending·0 cites
- 1038US2013062744A1Power module packageKIM KWANG SOO·Filed 2011·Application pending·0 cites
- 1137US2012111610A1Heat-radiating substrate and method for manufacturing the sameKIM KWANG SOO·Filed 2011·Application pending·0 cites
- 1235US2012000697A1Printed circuit board and method of manufacturing the sameKANG JUNG EUN·Filed 2010·Application pending·0 cites
- 1330US2012067623A1Heat-radiating substrate and method for manufacturing the samePARK SUNG KEUN·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →