Inventor · disambiguated record
Akira Ogata
Also filed as: OGATA AKIRA
9 granted patents·2 pending applications·133 citations·filing 1996–2016
88Inventor score
Top patents by PatentIndex Score
11 records- 0184US6517689B1Plating deviceEBARA CORP·Filed 1999·Granted Feb 11, 2003·57 cites·29 claims
- 0277US10019679B2Management apparatus and management method of information processing apparatusFUJITSU LTD·Filed 2014·Granted Jul 10, 2018·3 cites·21 claims
- 0371US8607344B1System, method, and computer program product for initiating a security action at an intermediate layer coupled between a library and an applicationLIBENZI DAVIDE·Filed 2008·Granted Dec 10, 2013·6 cites·17 claims
- 0465US6042454ASystem for detecting the endpoint of the polishing of a semiconductor wafer by a semiconductor wafer polisherEBARA CORP·Filed 1998·Granted Mar 28, 2000·28 cites·7 claims
- 0554US7341634B2Apparatus for and method of processing substrateEBARA CORP·Filed 2003·Granted Mar 11, 2008·4 cites·10 claims
- 0654US5888126APolishing apparatus including turntable with polishing surface of different heightsEBARA CORP·Filed 1996·Granted Mar 30, 1999·15 cites·21 claims
- 0751US2015086303A1Processing object transport system, and substrate inspection systemNIDEC READ CORP·Filed 2014·Application pending·0 cites
- 0849US6102786APolishing apparatus including turntable with polishing surface of different heightsEBARA CORP·Filed 1999·Granted Aug 15, 2000·12 cites·13 claims
- 0945US2016163576A1Processing object transport system, and substrate inspection systemNIDEC READ CORP·Filed 2016·Application pending·0 cites
- 1038US6500317B1Plating apparatus for detecting the conductivity between plating contacts on a substrateEBARA CORP·Filed 1998·Granted Dec 31, 2002·8 cites·5 claims
- 1135USRE39262EPolishing apparatus including turntable with polishing surface of different heightsEBARA CORP·Filed 2001·Granted Sep 5, 2006·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →