Inventor · disambiguated record
Masashi Uecha
Also filed as: UECHA MASASHI
3 granted patents·12 pending applications·0 citations·filing 2022–2025
42Inventor score
Files withDENSO CORP15
Top patents by PatentIndex Score
15 records- 0171US2025336726A1Manufacturing method of semiconductor deviceDENSO CORP·Filed 2025·Application pending·0 cites
- 0265US12424496B2Manufacturing method of semiconductor deviceDENSO CORP·Filed 2022·Granted Sep 23, 2025·0 cites·6 claims
- 0355US2025201632A1Method for manufacturing semiconductor deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 0454US2025253182A1Method for manufacturing semiconductor deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 0553US12426329B2Silicon carbide semiconductor device including a side silicide layer and method for manufacturing the sameDENSO CORP·Filed 2022·Granted Sep 23, 2025·0 cites·10 claims
- 0653US2024162092A1Manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 0752US2024038590A1Semiconductor device and manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 0852US2024038711A1Semiconductor device and manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 0951US2024030056A1Manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 1050US12501712B2Method of forming grooves and vertical cracks in a wafer comprising individual semiconductor elements to separate the semiconductor elements by cleaving the wafer along the grooves and the vertical cracksDENSO CORP·Filed 2023·Granted Dec 16, 2025·0 cites·6 claims
- 1149US2025054875A1Semiconductor device and manufacturing method of semiconductor deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 1248US2023268185A1Manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 1347US2023178497A1Semiconductor device and method for manufacturing the sameDENSO CORP·Filed 2022·Application pending·0 cites
- 1445US2025293094A1Method for manufacturing semiconductor deviceDENSO CORP·Filed 2025·Application pending·0 cites
- 1542US2023009078A1Method of manufacturing silicon carbide semiconductor deviceDENSO CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →