Manufacturing method of semiconductor device

Abstract

A manufacturing method of a semiconductor device, includes: preparing a wafer having a first surface on which a plurality of semiconductor elements is formed and to which a support plate is attached through an adhesive; grinding a second surface of the wafer opposite to the first surface in a state where the support plate is attached to the first surface of the wafer; forming a vertical crack inside the wafer and along a boundary between the adjacent semiconductor elements by pressing a scribe wheel against the wafer along the boundary; separating the support plate from the wafer while leaving the adhesive on the first surface of the wafer; cleaving the wafer along the boundary by pressing a breaking bar against the wafer over the adhesive and along the boundary; and removing the adhesive from at least one of the semiconductor elements divided from the wafer by the cleaving.

What is claimed is: 
     
         1 . A manufacturing method of a semiconductor device, comprising:
 preparing a wafer having a first surface on which a plurality of semiconductor elements is formed and to which a support plate is attached through an adhesive;   grinding a second surface of the wafer opposite to the first surface in a state where the support plate is attached to the first surface of the wafer;   forming a vertical crack inside the wafer and along a boundary between the adjacent semiconductor elements by pressing a scribe wheel against the wafer along the boundary;   separating the support plate from the wafer while leaving the adhesive on the first surface of the wafer;   cleaving the wafer along the boundary by pressing a breaking bar against the wafer over the adhesive and along the boundary; and   removing the adhesive from at least one of the semiconductor elements that has been divided from the wafer by the cleaving.   
     
     
         2 . The manufacturing method according to  claim 1 , wherein
 the separating of the support plate includes curing a surface layer of the adhesive, and separating the support plate from the adhesive.   
     
     
         3 . The manufacturing method according to  claim 1 , wherein
 the cleaving of the wafer along the boundary includes attaching a protective sheet on a surface of the adhesive before the pressing of the breaking bar against the wafer.   
     
     
         4 . The manufacturing method according to  claim 2 , wherein
 the cleaving of the wafer along the boundary includes attaching a protective sheet on a surface of the adhesive before the pressing of the breaking bar against the wafer.