Inventor · disambiguated record
Yuji Nagumo
Also filed as: NAGUMO YUJI
4 granted patents·11 pending applications·10 citations·filing 2021–2025
62Inventor score
Files withDENSO CORP15
Top patents by PatentIndex Score
15 records- 0194US11881407B2Processed wafer and method of manufacturing chip formation waferDENSO CORP·Filed 2021·Granted Jan 23, 2024·10 cites·5 claims
- 0271US2025336726A1Manufacturing method of semiconductor deviceDENSO CORP·Filed 2025·Application pending·0 cites
- 0365US12424496B2Manufacturing method of semiconductor deviceDENSO CORP·Filed 2022·Granted Sep 23, 2025·0 cites·6 claims
- 0455US2025201632A1Method for manufacturing semiconductor deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 0554US2025253182A1Method for manufacturing semiconductor deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 0653US12426329B2Silicon carbide semiconductor device including a side silicide layer and method for manufacturing the sameDENSO CORP·Filed 2022·Granted Sep 23, 2025·0 cites·10 claims
- 0753US2024162092A1Manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 0852US2024038590A1Semiconductor device and manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 0952US2024038711A1Semiconductor device and manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 1051US2024030056A1Manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 1150US12501712B2Method of forming grooves and vertical cracks in a wafer comprising individual semiconductor elements to separate the semiconductor elements by cleaving the wafer along the grooves and the vertical cracksDENSO CORP·Filed 2023·Granted Dec 16, 2025·0 cites·6 claims
- 1249US2025054875A1Semiconductor device and manufacturing method of semiconductor deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 1348US2023268185A1Manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 1447US2023178497A1Semiconductor device and method for manufacturing the sameDENSO CORP·Filed 2022·Application pending·0 cites
- 1545US2025293094A1Method for manufacturing semiconductor deviceDENSO CORP·Filed 2025·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yuji Nagumo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →