Inventor · disambiguated record

Chi-Hsin Chiu

Also filed as: CHIU CHI-HSIN

13 granted patents·10 pending applications·35 citations·filing 2008–2024

88Inventor score

Technology areasH10W H10P H01L

Files withSILICONWARE PRECISION INDUSTRIES CO LTD17 CHIU CHI-HSIN2 HUANG HUEI-NUAN2 Chen lu yi1 HUANG PIN-CHENG1

Top patents by PatentIndex Score

23 records

0196US11676948B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Jun 13, 2023·6 cites·11 claims
0292US8420430B2Fabrication method of package structure having MEMS elementCHIU CHI-HSIN·Filed 2010·Granted Apr 16, 2013·17 cites·9 claims
0385US11056470B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Jul 6, 2021·3 cites·11 claims
0482US2025046771A1Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
0578US12176327B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·10 claims
0677US9520304B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Dec 13, 2016·4 cites·34 claims
0772US8716070B2Fabrication method of package structure having MEMS elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted May 6, 2014·2 cites·26 claims
0867US9991178B2Interposer and electrical testing method thereofChen lu yi·Filed 2012·Granted Jun 5, 2018·2 cites·8 claims
0963US8866236B2Package structure having MEMS elementCHIU CHI-HSIN·Filed 2010·Granted Oct 21, 2014·1 cites·14 claims
1058US9254994B2Package structure having MEMS elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 9, 2016·0 cites·13 claims
1156US10615055B2Method for fabricating package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Apr 7, 2020·0 cites·18 claims
1254US10950507B2Electrical testing method of interposerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Mar 16, 2021·0 cites·12 claims
1350US2009032928A1Multi-chip stack structure having through silicon via and method for fabrication the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
1449US2015035164A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
1547US10199239B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Feb 5, 2019·0 cites·7 claims
1646US2011227226A1Multi-chip stack structure having through silicon viaSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2011·Application pending·0 cites
1746US2017148761A1Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
1843US2013326873A1Method of fabricating multi-chip stack package structure having inner layer heat-dissipating boardSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
1941US2015035163A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
2037US8520391B2Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereofHUANG HUEI-NUAN·Filed 2011·Granted Aug 27, 2013·0 cites·15 claims
2136US2013020709A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2011·Application pending·0 cites
2231US2012168936A1Multi-chip stack package structure and fabrication method thereofHUANG PIN-CHENG·Filed 2011·Application pending·0 cites
2329US2013256915A1Packaging substrate, semiconductor package and fabrication method thereofHUANG HUEI-NUAN·Filed 2012·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →