Inventor · disambiguated record
Carlo Marbella
Also filed as: MARBELLA CARLO · MARBELLA CARLO BATERNA
8 granted patents·2 pending applications·13 citations·filing 2012–2020
76Inventor score
Top patents by PatentIndex Score
10 records- 0181US8816390B2System and method for an electronic package with a fail-open mechanismMARBELLA CARLO BATERNA·Filed 2012·Granted Aug 26, 2014·11 cites·18 claims
- 0267US9343397B2Method of connecting a semiconductor package to a boardINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 17, 2016·2 cites·10 claims
- 0351US10085353B2Solder bridging prevention structures for circuit boards and semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 25, 2018·0 cites·20 claims
- 0447US11152321B2Semiconductor device having a copper pillar interconnect structureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 19, 2021·0 cites·17 claims
- 0545US10181439B2Substrate and method for fabrication thereofINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jan 15, 2019·0 cites·18 claims
- 0642US9082737B2System and method for an electronic package with a fail-open mechanismINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jul 14, 2015·0 cites·24 claims
- 0742US2016329292A1Semiconductor Package Configured for Connection to a BoardINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
- 0841US2016141187A1Method of manufacturing an integrated circuit with imprint, integrated circuit with imprint, device for forming an integrated circuit with imprint and verification system for an integrated circuit with imprintINFINEON TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 0936US10937709B2Substrates for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 2, 2021·0 cites·20 claims
- 1033US9387613B2Semiconductor formation arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jul 12, 2016·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →