Semiconductor Package Configured for Connection to a Board

Abstract

A semiconductor package includes a plurality of contact areas having a specific contact area and a plurality of solder balls applied to the contact areas. Two or more specific solder balls are applied to the specific contact area, and a minimum distance between the two specific solder balls is set such that the two or more specific solder balls merge into one another when connecting them to a substrate in a reflow process.

What is claimed is: 
     
         1 . A semiconductor package, comprising:
 a plurality of contact areas comprising a specific contact area; and   a plurality of solder balls applied to the contact areas, wherein two or more specific solder balls are applied to the specific contact area and wherein a minimum distance between the two or more specific solder balls is set such that the two or more specific solder balls merge into one another when connecting them to a substrate in a reflow process.   
     
     
         2 . The semiconductor package of  claim 1 , further comprising:
 two or more specific contact areas; and   two or more specific solder balls applied, to each one of the two or more specific contact areas.   
     
     
         3 . The semiconductor package of  claim 2 , wherein the semiconductor package comprises a rectangular or quadratic main face, the semiconductor package further comprising:
 four specific contact areas, wherein each one of the four specific contact areas is located adjacent to one of the four corners of the main face or adjacent to one of the centers of the four side edges of the main face.   
     
     
         4 . The semiconductor package of  claim 1 , wherein the two or more specific solder balls have no electrical functionality. 
     
     
         5 . The semiconductor package of  claim 1 , wherein the two or more specific solder bails are applied to dummy pads within the specific contact area. 
     
     
         6 . The semiconductor package of  claim 1 , further comprising:
 a solder resist layer comprising a plurality of openings disposed above the specific contact area, wherein the number of openings corresponds to the number of specific solder balls and the specific solder balls are arranged in the openings.   
     
     
         7 . A semiconductor package, comprising:
 a semiconductor chip;   a main face; and   a plurality of solder balls arranged on the main face, the plurality of solder balls comprising a group of specific solder balls, the group of specific solder balls being electrically disconnected from the semiconductor chip.   
     
     
         8 . The semiconductor package of  claim 7 , wherein the group of specific solder balls consists of two, three or four specific solder balls. 
     
     
         9 . The semiconductor package of  claim 7 , wherein the specific solder balls of the group of specific solder balls are arranged in a regular manner. 
     
     
         10 . The semiconductor package of claim.  7 , wherein a minimum distance between two of the specific solder balls lies in a range from 0.2 mm to 1.5 mm. 
     
     
         11 . The semiconductor package of  claim 7 , further comprising:
 an uncured polymer material applied to the group of specific solder balls.