Inventor · disambiguated record
Yoshirou Nakata
Also filed as: NAKATA YOSHIROU
12 granted patents·370 citations·filing 1996–2013
91Inventor score
Top patents by PatentIndex Score
12 records- 0197US5945834ASemiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Aug 31, 1999·160 cites·7 claims
- 0296US6005401ASemiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 21, 1999·140 cites·8 claims
- 0381US7589543B2Probe card having a conductive thin film on the surface of an insulating film behind each of the alignment marks each marks comprises a plurality of second bumpsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Sep 15, 2009·9 cites·2 claims
- 0480US8659312B2Probe card and semiconductor wafer inspection method using the sameNAKATA YOSHIROU·Filed 2010·Granted Feb 25, 2014·6 cites·17 claims
- 0580US6323663B1Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Nov 27, 2001·37 cites·7 claims
- 0675US7170189B2Semiconductor wafer and testing method thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jan 30, 2007·7 cites·18 claims
- 0773US8638118B2Wafer inspection devicePANASONIC CORP·Filed 2013·Granted Jan 28, 2014·2 cites·4 claims
- 0869US7982482B2Probe card, method of manufacturing the probe card and alignment methodPANASONIC CORP·Filed 2009·Granted Jul 19, 2011·4 cites·6 claims
- 0957US8598902B2Probe, electronic device test apparatus, and method of producing the sameUMEMURA YOSHIHARU·Filed 2009·Granted Dec 3, 2013·3 cites·28 claims
- 1054US7673205B2Semiconductor IC and testing method thereofPANASONIC CORP·Filed 2007·Granted Mar 2, 2010·2 cites·1 claims
- 1146US8400182B2Wafer inspection device and semiconductor wafer inspection method using the sameNAKATA YOSHIROU·Filed 2010·Granted Mar 19, 2013·0 cites·3 claims
- 1239US7768285B2Probe card for semiconductor IC test and method of manufacturing the samePANASONIC CORP·Filed 2007·Granted Aug 3, 2010·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →