Inventor · disambiguated record
Vincent Chan
Also filed as: CHAN VINCENT · CHAN VINCENT K · CHAN VINCENT KENT · CHAN VINCENT TAK WING
16 granted patents·10 pending applications·466 citations·filing 1978–2012
94Inventor score
Files withATI TECHNOLOGIES INC8ATI TECHNOLOGIES ULC5ADVANCED MICRO DEVICES INC2MCLELLAN NEIL R2CHAN VINCENT1
Top patents by PatentIndex Score
26 records- 0198US7015826B1Method and apparatus for sensing and transmitting a body characteristic of a hostDIGITAL ANGEL CORP·Filed 2002·Granted Mar 21, 2006·236 cites·114 claims
- 0295US7670939B2Semiconductor chip bump connection apparatus and methodATI TECHNOLOGIES ULC·Filed 2008·Granted Mar 2, 2010·67 cites·16 claims
- 0388US8120170B2Integrated package circuit with stiffenerMCLELLAN NEIL R·Filed 2008·Granted Feb 21, 2012·13 cites·16 claims
- 0486US8847383B2Integrated circuit package strip with stiffenerMCLELLAN NEIL R·Filed 2012·Granted Sep 30, 2014·7 cites·11 claims
- 0586US6849940B1Integrated circuit package for the transfer of heat generated by the inte circuit and method of fabricating sameATI TECHNOLOGIES INC·Filed 2000·Granted Feb 1, 2005·50 cites·12 claims
- 0682US7985621B2Method and apparatus for making semiconductor packagesATI TECHNOLOGIES ULC·Filed 2006·Granted Jul 26, 2011·8 cites·36 claims
- 0782US7799608B2Die stacking apparatus and methodADVANCED MICRO DEVICES INC·Filed 2007·Granted Sep 21, 2010·10 cites·17 claims
- 0882US7432825B2Interrogation device and method for scanningDESTRON FEARING CORP·Filed 2003·Granted Oct 7, 2008·18 cites·8 claims
- 0980US6929976B2Multi-die module and method thereofATI TECHNOLOGIES INC·Filed 2003·Granted Aug 16, 2005·23 cites·16 claims
- 1070US7914648B2Device for web control having a plurality of surface featuresPROCTER & GAMBLE·Filed 2008·Granted Mar 29, 2011·2 cites·20 claims
- 1168US6798667B2Solder ball collapse control apparatus and method thereofATI TECHNOLOGIES INC·Filed 2002·Granted Sep 28, 2004·15 cites·11 claims
- 1267US7969020B2Die stacking apparatus and methodADVANCED MICRO DEVICES INC·Filed 2010·Granted Jun 28, 2011·2 cites·19 claims
- 1367US7215022B2Multi-die moduleATI TECHNOLOGIES INC·Filed 2001·Granted May 8, 2007·11 cites·36 claims
- 1465US8378471B2Semiconductor chip bump connection apparatus and methodATI TECHNOLOGIES ULC·Filed 2010·Granted Feb 19, 2013·1 cites·16 claims
- 1550US2009248145A1Method of forming a three-dimensional structure of unidirectionally aligned cellsUNIV NANYANG·Filed 2008·Application pending·0 cites
- 1649US2008054490A1Flip-Chip Ball Grid Array Strip and PackageATI TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 1747US8637391B2Flip chip semiconductor assembly with variable volume solder bumpsCHAN VINCENT K·Filed 2009·Granted Jan 28, 2014·0 cites·13 claims
- 1847US2008048321A1Flip chip semiconductor assembly with variable volume solder bumpsATI TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 1946US2008245555A1Circuit substrate with plated through hole structure and methodATI TECHNOLOGIES ULC·Filed 2007·Application pending·0 cites
- 2045US2008099910A1Flip-Chip Semiconductor Package with Encapsulant Retaining Structure and StripATI TECHNOLOGIES INC·Filed 2007·Application pending·0 cites
- 2143US2008169555A1Anchor structure for an integrated circuitATI TECHNOLOGIES ULC·Filed 2007·Application pending·0 cites
- 2238US2003019772A1Apparatus for holding a media storage disk having a resilient hubFiled 2002·Application pending·0 cites
- 2338US2006051912A1Method and apparatus for a stacked die configurationATI TECHNOLOGIES INC·Filed 2004·Application pending·0 cites
- 2434US2004241906A1Integrated circuit package and method for making same that employs under bump metalization layerFiled 2003·Application pending·0 cites
- 2533US2003089998A1Direct interconnect multi-chip module, method for making the same and electronic package comprising sameFiled 2001·Application pending·0 cites
- 2628US4190792APositioning control systemCHAN VINCENT·Filed 1978·Granted Feb 26, 1980·3 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →