Inventor · disambiguated record
William M. Denty, Jr.
Also filed as: DENTY JR WILLIAM M · DENTY WILLIAM M · DENTY WILLIAM M JR
10 granted patents·2 pending applications·441 citations·filing 1998–2014
91Inventor score
Top patents by PatentIndex Score
12 records- 0198US6170429B1Chamber liner for semiconductor process chambersLAM RES CORP·Filed 1998·Granted Jan 9, 2001·233 cites·15 claims
- 0296US7854820B2Upper electrode backing member with particle reducing featuresLAM RES CORP·Filed 2006·Granted Dec 21, 2010·38 cites·7 claims
- 0396US6277237B1Chamber liner for semiconductor process chambersLAM RES CORP·Filed 2000·Granted Aug 21, 2001·75 cites·12 claims
- 0491US7169231B2Gas distribution system with tuning gasLAM RES CORP·Filed 2002·Granted Jan 30, 2007·47 cites·13 claims
- 0586US8702866B2Showerhead electrode assembly with gas flow modification for extended electrode lifeAUGUSTINO JASON·Filed 2006·Granted Apr 22, 2014·10 cites·19 claims
- 0686US7371332B2Uniform etch systemLAM RES CORP·Filed 2003·Granted May 13, 2008·29 cites·11 claims
- 0785US9234775B2Methods for verifying gas flow rates from a gas supply system into a plasma processing chamberLAM RES CORP·Filed 2013·Granted Jan 12, 2016·6 cites·25 claims
- 0871US8709202B2Upper electrode backing member with particle reducing featuresDE LA LLERA ANTHONY·Filed 2010·Granted Apr 29, 2014·2 cites·11 claims
- 0963US8801892B2Uniform etch systemLARSON DEAN J·Filed 2008·Granted Aug 12, 2014·1 cites·7 claims
- 1053US9093483B2Showerhead electrode assembly with gas flow modification for extended electrode lifeLAM RES CORP·Filed 2014·Granted Jul 28, 2015·0 cites·17 claims
- 1141US2007021935A1Methods for verifying gas flow rates from a gas supply system into a plasma processing chamberLARSON DEAN J·Filed 2005·Application pending·0 cites
- 1238US2004112540A1Uniform etch systemLAM RES CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →