Inventor · disambiguated record
Ezio Bovio
Also filed as: BOVIO EZIO
9 granted patents·1 pending application·54 citations·filing 2000–2023
86Inventor score
Files withGLOBALWAFERS CO LTD4MEMC ELECTRONIC MATERIALS SPA3MEMC ELECTRONIC MATERIALS2SUNEDISON SEMICONDUCTOR LTD UEN201334164H1
Top patents by PatentIndex Score
10 records- 0191US11707813B2Semiconductor wafer thermal removal controlGLOBALWAFERS CO LTD·Filed 2021·Granted Jul 25, 2023·2 cites·20 claims
- 0286US10654145B2Methods and systems for polishing pad controlSUNEDISON SEMICONDUCTOR LTD UEN201334164H·Filed 2016·Granted May 19, 2020·2 cites·13 claims
- 0382US10960513B2Methods and systems for polishing pad controlGLOBALWAFERS CO LTD·Filed 2018·Granted Mar 30, 2021·2 cites·19 claims
- 0482US10946493B2Methods and systems for polishing pad controlGLOBALWAFERS CO LTD·Filed 2018·Granted Mar 16, 2021·2 cites·19 claims
- 0581US12350784B2Semiconductor wafer thermal removal controlGLOBALWAFERS CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·18 claims
- 0676US7137874B1Semiconductor wafer, polishing apparatus and methodMEMC ELECTRONIC MATERIALS SPA·Filed 2000·Granted Nov 21, 2006·25 cites·30 claims
- 0766US6878302B1Method of polishing wafersMEMC ELECTRONIC MATERIALS SPA·Filed 2000·Granted Apr 12, 2005·15 cites·17 claims
- 0863US7846007B2System and method for dressing a wafer polishing padMEMC ELECTRONIC MATERIALS·Filed 2009·Granted Dec 7, 2010·3 cites·22 claims
- 0962US7846006B2Dressing a wafer polishing padMEMC ELECTRONIC MATERIALS·Filed 2007·Granted Dec 7, 2010·3 cites·12 claims
- 1038US2013000672A1Cleaning tool for polysilicon reactorMEMC ELECTRONIC MATERIALS SPA·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →