Inventor · disambiguated record
Seungyun Ahn
Also filed as: AHN SEUNGYUN
12 granted patents·1 pending application·102 citations·filing 2006–2011
90Inventor score
Top patents by PatentIndex Score
13 records- 0193US9330945B2Integrated circuit package system with multi-chip moduleSONG SUNGMIN·Filed 2007·Granted May 3, 2016·33 cites·14 claims
- 0287US8067306B2Integrated circuit packaging system with exposed conductor and method of manufacture thereofYANG DEOKKYUNG·Filed 2010·Granted Nov 29, 2011·11 cites·20 claims
- 0387US7863755B2Package-on-package system with via Z-interconnectionsSTATS CHIPPAC LTD·Filed 2008·Granted Jan 4, 2011·13 cites·17 claims
- 0484US8535981B2Integrated circuit package-on-package system with underfilling structures and method of manufacture thereofKO CHAN HOON·Filed 2011·Granted Sep 17, 2013·9 cites·10 claims
- 0581US8609463B2Integrated circuit package system employing multi-package module techniquesKO WONJUN·Filed 2007·Granted Dec 17, 2013·11 cites·18 claims
- 0677US8221583B2System for peeling semiconductor chips from tapeMIN GAB YONG·Filed 2008·Granted Jul 17, 2012·12 cites·20 claims
- 0776US8258008B2Package-on-package system with via z-interconnections and method for manufacturing thereofLEE TAEWOO·Filed 2010·Granted Sep 4, 2012·4 cites·17 claims
- 0872US7521297B2Multichip package systemSTATS CHIPPAC LTD·Filed 2006·Granted Apr 21, 2009·5 cites·20 claims
- 0962US8501535B2Integrated circuit package system with dual side connection and method for manufacturing thereofSONG SUNGMIN·Filed 2011·Granted Aug 6, 2013·1 cites·18 claims
- 1057US8643181B2Integrated circuit packaging system with encapsulation and method of manufacture thereofBAE JOHYUN·Filed 2010·Granted Feb 4, 2014·1 cites·20 claims
- 1156US9093391B2Integrated circuit packaging system with fan-in package and method of manufacture thereofAHN SEUNGYUN·Filed 2009·Granted Jul 28, 2015·2 cites·20 claims
- 1250US7884457B2Integrated circuit package system with dual side connectionSTATS CHIPPAC LTD·Filed 2007·Granted Feb 8, 2011·0 cites·7 claims
- 1339US2007268660A1Spacerless semiconductor package chip stacking systemSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →