Inventor · disambiguated record
Masato Fukasawa
Also filed as: FUKASAWA MASATO
20 granted patents·11 pending applications·100 citations·filing 1988–2024
93Inventor score
Top patents by PatentIndex Score
31 records- 0187US7837800B2CMP polishing slurry and polishing methodHITACHI CHEMICAL CO LTD·Filed 2008·Granted Nov 23, 2010·10 cites·8 claims
- 0285US8084363B2Polishing slurry and polishing methodAMANOKURA JIN·Filed 2009·Granted Dec 27, 2011·10 cites·6 claims
- 0378US8609541B2Polishing slurry for metal films and polishing methodTANAKA TAKAAKI·Filed 2008·Granted Dec 17, 2013·5 cites·20 claims
- 0477US8084362B2Polishing slurry and polishing methodAMANOKURA JIN·Filed 2007·Granted Dec 27, 2011·5 cites·5 claims
- 0576US9299573B2Polishing methodHITACHI CHEMICAL CO LTD·Filed 2013·Granted Mar 29, 2016·4 cites·17 claims
- 0676US7838482B2CMP polishing compound and polishing methodHITACHI CHEMICAL CO LTD·Filed 2004·Granted Nov 23, 2010·15 cites·9 claims
- 0773US8501625B2Polishing liquid for metal film and polishing methodHAGA KOUJI·Filed 2008·Granted Aug 6, 2013·4 cites·5 claims
- 0871US8481428B2Polishing slurry and polishing methodAMANOKURA JIN·Filed 2011·Granted Jul 9, 2013·2 cites·7 claims
- 0971US8168541B2CMP polishing slurry and polishing methodFUKASAWA MASATO·Filed 2010·Granted May 1, 2012·2 cites·16 claims
- 1065US8075800B2Polishing slurry and polishing methodKOYAMA NAOYUKI·Filed 2004·Granted Dec 13, 2011·13 cites·15 claims
- 1162US9293344B2Cmp polishing slurry and method of polishing substrateFUKASAWA MASATO·Filed 2005·Granted Mar 22, 2016·2 cites·16 claims
- 1260US8734204B2Polishing solution for metal films and polishing method using the sameHAGA KOUJI·Filed 2009·Granted May 27, 2014·1 cites·11 claims
- 1359US8524111B2CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing methodFUKASAWA MASATO·Filed 2007·Granted Sep 3, 2013·1 cites·30 claims
- 1458US2025050638A1Liquid ejection head and liquid ejection deviceRISO TECH CORPORATION·Filed 2024·Application pending·0 cites
- 1557US4985328ADry toner, dry developer and process for forming electrophotographic imagesHITACHI CHEMICAL CO LTD·Filed 1989·Granted Jan 15, 1991·20 cites·31 claims
- 1652US8901002B2Polishing slurry for metal films and polishing methodHITACHI CHEMICAL CO LTD·Filed 2013·Granted Dec 2, 2014·0 cites·20 claims
- 1750US2013217229A1Polishing liquid for metal film and polishing methodHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 1850US2024416652A1Liquid discharge head and liquid discharge deviceRISO TECH CORPORATION·Filed 2024·Application pending·0 cites
- 1949US8900335B2CMP polishing slurry and method of polishing substrateFUKASAWA MASATO·Filed 2010·Granted Dec 2, 2014·0 cites·8 claims
- 2049US8288282B2Polishing liquid for metal and method of polishingNOMURA YUTAKA·Filed 2008·Granted Oct 16, 2012·0 cites·22 claims
- 2148US2008254717A1Cmp Polishing Slurry and Method of Polishing SubstrateHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 2244US2009283715A1Polishing slurry for cmpNOBE SHIGERU·Filed 2007·Application pending·0 cites
- 2343US4954406AElectrophotographic plate including an undercoating layer having a smooth surfaceHITACHI CHEMICAL CO LTD·Filed 1988·Granted Sep 4, 1990·6 cites·7 claims
- 2443US2007175104A1Polishing slurry for silicon oxide, additive liquid and polishing methodHITACHI CHEMICAL CO LTD·Filed 2006·Application pending·0 cites
- 2542US2010015806A1Cmp polishing slurry, additive liquid for cmp polishing slurry, and substrate-polishing processes using the sameFUKASAWA MASATO·Filed 2007·Application pending·0 cites
- 2641US2007218811A1Cmp polishing slurry and method of polishing substrateHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 2739US2018072051A1Ink jet headTOSHIBA TEC KK·Filed 2017·Application pending·0 cites
- 2839US2005050803A1Polishing fluid and polishing methodFiled 2002·Application pending·0 cites
- 2939US2018072052A1Ink jet headTOSHIBA TEC KK·Filed 2017·Application pending·0 cites
- 3038US11046869B2Polishing liquid, polishing liquid set, and substrate polishing methodHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jun 29, 2021·0 cites·22 claims
- 3130US9022834B2Polishing solution for CMP and polishing method using the polishing solutionSATOU EIICHI·Filed 2011·Granted May 5, 2015·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →