Inventor · disambiguated record
Jin Wen Dong
Also filed as: DONG JIN · DONG JIN WEN
15 granted patents·2 pending applications·43 citations·filing 2018–2023
90Inventor score
Files withYANGTZE MEMORY TECH CO LTD17
Top patents by PatentIndex Score
17 records- 0198US11133325B2Memory cell structure of a three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 28, 2021·14 cites·9 claims
- 0291US10867678B2Three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Dec 15, 2020·8 cites·19 claims
- 0389US10515975B1Method for forming dual-deck channel hole structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Dec 24, 2019·6 cites·20 claims
- 0487US10840125B2Memory structure and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Nov 17, 2020·6 cites·18 claims
- 0586US10644015B2Memory cell structure of a three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted May 5, 2020·3 cites·9 claims
- 0683US10497708B1Memory structure and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Dec 3, 2019·4 cites·20 claims
- 0782US10847528B2Memory cell structure of a three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Nov 24, 2020·1 cites·20 claims
- 0875US10910390B2Memory device and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Feb 2, 2021·1 cites·20 claims
- 0973US12063780B2Memory cell structure of a three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 13, 2024·0 cites·20 claims
- 1071US11380701B2Memory device and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jul 5, 2022·0 cites·20 claims
- 1171US11271004B2Memory device and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Mar 8, 2022·0 cites·19 claims
- 1270US11211393B2Memory device and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Dec 28, 2021·0 cites·19 claims
- 1362US2021118905A1Three-Dimensional Memory Devices and Fabricating Methods ThereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Application pending·0 cites
- 1456US10892274B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Jan 12, 2021·0 cites·13 claims
- 1556US2025142817A1Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1647US10692756B1Method for forming dual damascene interconnect structureYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Jun 23, 2020·0 cites·20 claims
- 1744US11329061B2Method for improving channel hole uniformity of a three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted May 10, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →