Inventor · disambiguated record
Ling-Chen Kung
Also filed as: KUNG LING-CHEN
8 granted patents·701 citations·filing 1998–2006
91Inventor score
Top patents by PatentIndex Score
8 records- 0195US6277669B1Wafer level packaging method and packages formedIND TECH RES INST·Filed 1999·Granted Aug 21, 2001·274 cites·22 claims
- 0292US6197613B1Wafer level packaging method and devices formedIND TECH RES INST·Filed 1999·Granted Mar 6, 2001·156 cites·18 claims
- 0387US7579694B2Electronic devices including offset conductive bumpsUNITIVE INT LTD·Filed 2006·Granted Aug 25, 2009·19 cites·19 claims
- 0487US6268114B1Method for forming fine-pitched solder bumpsIND TECH RES INST·Filed 1998·Granted Jul 31, 2001·97 cites·22 claims
- 0586US7081404B2Methods of selectively bumping integrated circuit substrates and related structuresUNITIVE ELECTRONICS INC·Filed 2004·Granted Jul 25, 2006·56 cites·51 claims
- 0672US6179200B1Method for forming solder bumps of improved height and devices formedIND TECH RES INST·Filed 1999·Granted Jan 30, 2001·35 cites·18 claims
- 0765US6440836B1Method for forming solder bumps on flip chips and devices formedIND TECH RES INST·Filed 1999·Granted Aug 27, 2002·33 cites·19 claims
- 0864US6539624B1Method for forming wafer level packageIND TECH RES INST·Filed 1999·Granted Apr 1, 2003·31 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →