Inventor · disambiguated record
Dieter Eissler
Also filed as: EISSLER DIETER
9 granted patents·2 pending applications·76 citations·filing 2005–2011
86Inventor score
Files withEISSLER DIETER4OSRAM OPTO SEMICONDUCTORS GMBH2AHLSTEDT MAGNUS1FISCHER HELMUT1GROLIER VINCENT1
Top patents by PatentIndex Score
11 records- 0194US8476644B2Optoelectronic component and method for the manufacture of a plurality of optoelectronic componentsILLEK STEFAN·Filed 2008·Granted Jul 2, 2013·41 cites·13 claims
- 0285US8835937B2Optoelectronic component, device comprising a plurality of optoelectronic components, and method for the production of an optoelectronic componentWIRTH RALPH·Filed 2005·Granted Sep 16, 2014·15 cites·20 claims
- 0373US8946761B2Radiation-emitting semiconductor chip and method for producing a radiation-emitting semiconductor chipEISSLER DIETER·Filed 2011·Granted Feb 3, 2015·2 cites·15 claims
- 0473US7906352B2Chip and method for producing a chipOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2006·Granted Mar 15, 2011·5 cites·26 claims
- 0570US8796714B2Light-emitting diode comprising a carrier body, a mirror layer, and two contact layersGROLIER VINCENT·Filed 2010·Granted Aug 5, 2014·2 cites·7 claims
- 0670US8502204B2Optoelectronic moduleEISSLER DIETER·Filed 2009·Granted Aug 6, 2013·5 cites·16 claims
- 0762US8501513B2Optoelectronic semiconductor component with current spreading layerAHLSTEDT MAGNUS·Filed 2006·Granted Aug 6, 2013·3 cites·7 claims
- 0860US8399893B2Luminous meansEISSLER DIETER·Filed 2009·Granted Mar 19, 2013·2 cites·15 claims
- 0955US8427839B2Arrangement comprising an optoelectronic componentEISSLER DIETER·Filed 2008·Granted Apr 23, 2013·1 cites·16 claims
- 1044US2010171215A1Method of Producing Optoelectronic Components and Optoelectronic ComponentFISCHER HELMUT·Filed 2008·Application pending·0 cites
- 1141US2008203410A1Methods for the Production of Luminescent Diode Chips and Luminescent Diode ChipOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →