Inventor · disambiguated record
Hyung-Gil Baek
Also filed as: BAEK HYUNG · BAEK HYUNG-GIL
17 granted patents·7 pending applications·96 citations·filing 2006–2022
92Inventor score
Top patents by PatentIndex Score
24 records- 0193US10008462B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 26, 2018·12 cites·9 claims
- 0291US10304781B2Semiconductor devices including guard ring and crack sensing circuitSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 28, 2019·7 cites·18 claims
- 0391US8056728B2Methods, systems, and devices for separating materials using magnetic and frictional propertiesRIISE BRIAN L·Filed 2009·Granted Nov 15, 2011·25 cites·11 claims
- 0487US10490514B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 26, 2019·4 cites·15 claims
- 0587US7642636B2Stack package of ball grid array typeSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jan 5, 2010·17 cites·19 claims
- 0683US9775230B2Printed circuit board and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 26, 2017·4 cites·20 claims
- 0783US7880291B2Integrated circuit package and integrated circuit moduleSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Feb 1, 2011·9 cites·20 claims
- 0882US11450614B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 20, 2022·1 cites·20 claims
- 0975US9984945B2Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 29, 2018·2 cites·8 claims
- 1075US7649248B2Stack package implementing conductive supportSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jan 19, 2010·7 cites·20 claims
- 1174US10103109B2Semiconductor device, semiconductor chip and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 16, 2018·2 cites·19 claims
- 1273US8633256B2Control of the melt flow rate of polyolefin mixtures recovered from post-consumer durable goodsRIISE BRIAN L·Filed 2012·Granted Jan 21, 2014·1 cites·24 claims
- 1371US10643958B2Semiconductor device, semiconductor chip and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 5, 2020·1 cites·20 claims
- 1467US11862570B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
- 1565US8640879B2Inclined chute sorterRIISE BRIAN L·Filed 2012·Granted Feb 4, 2014·2 cites·19 claims
- 1662US7812445B2Semiconductor memory module having an oblique memory chipSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 12, 2010·2 cites·23 claims
- 1752US12051680B2Semiconductor package aligning interposer and substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 30, 2024·0 cites·18 claims
- 1848US2008169547A1Semiconductor modules with enhanced joint reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1947US2006284309A1Integrated circuit package and integrated circuit moduleSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2046US2012067787A1Methods, systems, and devices for separating materials using magnetic and frictional propertiesRIISE BRIAN L·Filed 2011·Application pending·0 cites
- 2144US2008169548A1Semiconductor package having a semiconductor chip in a substrate and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2243US2007069396A1Semiconductor package, method of manufacturing the same, stacked semiconductor package including the same and method of manufacturing the stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2343US2008315379A1Semiconductor packages including thermal stress buffers and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2438US2011304056A1Stack-type semiconductor package and method of manufacturing the sameLEE DONG-HUN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →