Integrated circuit package and integrated circuit module

Abstract

An integrated circuit package may include a board that may support an integrated circuit chip. A post pin may be provided on a surface of the board. The post pin may be electrically connected to the integrated circuit chip. A land pin may be provided on the other surface of the board. The land pin may be electrically connected to the integrated circuit chip.

1 . A package comprising: 
 a board supporting an integrated circuit chip;    a post pin provided on a surface of the board, and electrically connected to the integrated circuit chip; and    a land pin provided on another surface of the board, and electrically connected to the integrated chip.    
   
   
       2 . The package of  claim 1 , wherein the post pin and the land pin provided at corresponding locations on the board, a via hole is provided between the post pin and the land pin, and the post pin and the land pin are electrically connected through metal in the via hole.  
   
   
       3 . The package of  claim 1 , further comprising a plurality of the post pins and the land pins.  
   
   
       4 . The package of  claim 1 , wherein the height of the post pin is in a range of 50 to 200 μm.  
   
   
       5 . The package of  claim 1 , wherein the height of the land pin is in a range of 0 to 30 μm.  
   
   
       6 . The package of  claim 1 , wherein corners of base portions of the post pin and the land pin are coated with photo solder resist.  
   
   
       7 . The package of  claim 1 , wherein the post pin and the land pin are fabricated from copper and coated with compound metal of gold and nickel.  
   
   
       8 . The package of  claim 1 , wherein the post pin and the land pin are fabricated from copper, which is coated with nickel, which is coated with gold.  
   
   
       9 . The package of  claim 1 , wherein the post pin and the land pin are fabricated from copper and coated with gold.  
   
   
       10 . The package of  claim 1 , wherein the post pin and the land pin are fabricated from nickel and coated with copper.  
   
   
       11 . The package of  claim 1 , wherein the post pin and the land pin have a square cross-sectional shape.  
   
   
       12 . The package of  claim 1 , wherein the land pin has as a concave shape.  
   
   
       13 . The package of  claim 12 , wherein a hole is provided in the land pin.  
   
   
       14 . The package of  claim 13 , wherein the hole of the land pin includes a main hole and a sub hole connected to the main hole.  
   
   
       15 . The package of  claim 1 , wherein the post pin has a circular post shape, and the diameter of the bottom surface of the post pin is shorter than a diameter of a base portion of the post pin.  
   
   
       16 . The package of  claim 13 , wherein the hole has a circular cross-sectional shape, and a diameter of the hole is longer than the diameter of the bottom surface of the post pin and shorter than a diameter of a base portion of the post pin.  
   
   
       17 . The package of  claim 1 , wherein the post pin has an arcuate cross-sectional shape having at least one furrow provided on a side surface.  
   
   
       18 . The package of  claim 13 , wherein the post pin has an arcuate cross-sectional shape having at least one furrow provided on a side surface, and the diameter of the hole is longer than the diameter of the bottom surface of the post pin and shorter than a diameter of a base portion of the post pin.  
   
   
       19 . A module comprising: 
 a first package including a first board, a land pin provided on the first board, and a first integrated circuit chip mounted on the first board, the land pin projecting from the first board and electrically connected to the first integrated circuit chip; and    a second package including a second board, a post pin, and a second integrated circuit chip mounted on the second board, the post pin projecting from the second board and electrically connected to the second integrated circuit chip;    the second package being stacked on the first package, such that the post pin is joined to the land pin.    
   
   
       20 . The module of  claim 19 , wherein the post pin is joined to the land pin by pressure of heated metal blocks.  
   
   
       21 . The module of  claim 19 , wherein heat sinks are mounted on the first and the second packages.  
   
   
       22 . The module of  claim 19 , wherein a joint area of the post pin and the land pin is coated with at least one of a ductile plating material and a bonding material.  
   
   
       23 . A module comprising: 
 a stack of packages, each package including 
 a board supporting an integrated circuit chip;  
 a post pin provided on a first surface of the board, and electrically connected to the integrated circuit chip; and  
 a land pin provided on a second surface of the board, and electrically connected to the integrated circuit chip;  
   the post pin of one package being joined to the land pin of an adjacent package.    
   
   
       24 . The module of  claim 23 , wherein the land pin projects from the board, and the post pin and the land pin are joined by pressure of heated metal blocks.  
   
   
       25 . The module of  claim 23 , wherein heat sinks are mounted on the packages.  
   
   
       26 . The module of  claim 23 , wherein a joint area of the post pin and the land pin is coated with at least one of a ductile plating material and a bonding material.  
   
   
       27 . The module of  claim 23 , wherein the land pin has a concave shape, and the post pin and the land pin are joined together by pressure of un-heated metal blocks.  
   
   
       28 . The module of  claim 27 , wherein a joint area of the post pin and the land pin is coated with at least one of a ductile plating material and a bonding material.  
   
   
       29 . A module comprising: 
 a printed circuit board including 
 a circuit board having electric circuits; and  
 a land pin provided on a surface of the circuit board, the land pin having a concavity, and electrically connected to the electric circuits; and  
   an integrated circuit package stacked on the printed circuit board.    
   
   
       30 . The module of  claim 29 , wherein the integrated circuit package includes: 
 a board having an integrated circuit chip; and    a post pin provided on a surface of the board, and electrically connected to the integrated circuit chip.    
   
   
       31 . The module of  claim 30 , wherein the diameter of the bottom surface of the post pin is shorter than a diameter of a base portion of the post pin.  
   
   
       32 . The module of  claim 29 , including a plurality of the post pins and the land pins.  
   
   
       33 . The module of  claim 29 , wherein a hole is provided in the land pin, and the hole having a diameter longer than the diameter of the bottom surface of the post pin and shorter than a diameter of a base portion of the post pin.  
   
   
       34 . The module of  claim 33 , wherein the hole of the land pin includes a main hole and a sub hole connected to the main hole.  
   
   
       35 . The module of  claim 29 , wherein the post pin has at least one groove provided on a side surface in a longitudinal direction, and the land pin has a circular hole in which the post pin is inserted.  
   
   
       36 . A package comprising: 
 a substrate;    an integrated circuit chip provided on the substrate; and    a pair of conductive supports provided on opposite sides of the substrate, the pair of conductive supports being electrically connected to the integrated circuit chip.