Inventor · disambiguated record
Stephen Lehman
Also filed as: LEHMAN JR STEPHEN E · LEHMAN JR STEPHEN EDWARD · LEHMAN STEPHEN · LEHMAN STEPHEN D
40 granted patents·8 pending applications·342 citations·filing 2002–2023
98Inventor score
Top patents by PatentIndex Score
48 records- 0198US9089840B2Method and system for forming plug and play oxide catalystsSDCMATERIALS INC·Filed 2013·Granted Jul 28, 2015·23 cites·12 claims
- 0298US9090475B1In situ oxide removal, dispersal and drying for silicon SiO2LEHMAN JR STEPHEN EDWARD·Filed 2010·Granted Jul 28, 2015·23 cites·28 claims
- 0397US9186663B2Method and system for forming plug and play metal compound catalystsSDCMATERIALS INC·Filed 2013·Granted Nov 17, 2015·19 cites·16 claims
- 0497US9119309B1In situ oxide removal, dispersal and dryingLEHMAN JR STEPHEN EDWARD·Filed 2010·Granted Aug 25, 2015·24 cites·13 claims
- 0597US9039916B1In situ oxide removal, dispersal and drying for copper copper-oxideLEHMAN JR STEPHEN EDWARD·Filed 2010·Granted May 26, 2015·25 cites·21 claims
- 0697US8507402B1Method and system for forming plug and play metal catalystsBIBERGER MAXIMILIAN A·Filed 2009·Granted Aug 13, 2013·25 cites·18 claims
- 0797US8481449B1Method and system for forming plug and play oxide catalystsBIBERGER MAXIMILIAN A·Filed 2007·Granted Jul 9, 2013·24 cites·13 claims
- 0896US12115697B2Apparatus for extruding ceramic slurryBOEING CO·Filed 2021·Granted Oct 15, 2024·3 cites·20 claims
- 0996US8575059B1Method and system for forming plug and play metal compound catalystsBIBERGER MAXIMILIAN A·Filed 2007·Granted Nov 5, 2013·23 cites·19 claims
- 1096US8507401B1Method and system for forming plug and play metal catalystsBIBERGER MAXIMILIAN A·Filed 2007·Granted Aug 13, 2013·23 cites·15 claims
- 1194US9592492B2Method and system for forming plug and play oxide catalystsSDCMATERIALS INC·Filed 2015·Granted Mar 14, 2017·4 cites·14 claims
- 1294US8586179B1Mechanical attachment for micro-truss actively cooled structural insulation layerJACOBSEN ALAN J·Filed 2010·Granted Nov 19, 2013·15 cites·19 claims
- 1394US7351784B2Chip-packaging composition of resin and cycloaliphatic amine hardenerINTEL CORP·Filed 2005·Granted Apr 1, 2008·27 cites·4 claims
- 1491US9302260B2Method and system for forming plug and play metal catalystsSDCMATERIALS INC·Filed 2013·Granted Apr 5, 2016·4 cites·15 claims
- 1591US8759248B2Method and system for forming plug and play metal catalystsSDCMATERIALS INC·Filed 2012·Granted Jun 24, 2014·4 cites·12 claims
- 1690US9597662B2Method and system for forming plug and play metal compound catalystsSDCMATERIALS INC·Filed 2015·Granted Mar 21, 2017·2 cites·17 claims
- 1790US7700476B2Solder joint reliability in microelectronic packagingINTEL CORP·Filed 2006·Granted Apr 20, 2010·15 cites·19 claims
- 1889US11123895B2Apparatus for extruding ceramic slurryBOEING CO·Filed 2017·Granted Sep 21, 2021·3 cites·20 claims
- 1989US7314778B2Wafer-level processing of chip-packaging compositions including bis-maleimidesINTEL CORP·Filed 2005·Granted Jan 1, 2008·8 cites·26 claims
- 2079US10029949B2Precursor material for additive manufacturing of low-density, high-porosity ceramic parts and methods of producing the sameBOEING CO·Filed 2016·Granted Jul 24, 2018·1 cites·20 claims
- 2177US8800641B2Methods and apparatus for a micro-truss based structural insulation layerJACOBSEN ALAN JON·Filed 2009·Granted Aug 12, 2014·6 cites·4 claims
- 2276US8009442B2Directing the flow of underfill materials using magnetic particlesINTEL CORP·Filed 2007·Granted Aug 30, 2011·6 cites·15 claims
- 2376US7534649B2Thermoset polyimides for microelectronic applicationsINTEL CORP·Filed 2006·Granted May 19, 2009·5 cites·10 claims
- 2474US12509403B2Insulating ceramic panels and methods of forming insulating ceramic panelsBOEING CO·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 2573US7504465B2Linear functional copolymers of ethylene with precise and minimum run length distributions and methods of making thereofEXXONMOBIL RES & ENG CO·Filed 2008·Granted Mar 17, 2009·2 cites·37 claims
- 2671US10106242B1Mechanically attached thermal protection systemBOEING CO·Filed 2014·Granted Oct 23, 2018·4 cites·18 claims
- 2771US7291548B2Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making sameINTEL CORP·Filed 2007·Granted Nov 6, 2007·5 cites·20 claims
- 2870US2025145821A1Oxygen scavenging polymers with improved haze characteristicsAURIGA POLYMERS INC·Filed 2023·Application pending·0 cites
- 2969US9737878B2Method and system for forming plug and play metal catalystsSDCMATERIALS INC·Filed 2016·Granted Aug 22, 2017·0 cites·13 claims
- 3068US10532953B2Precursor material for additive manufacturing of low-density, high-porosity ceramic parts and methods of producing the sameBOEING CO·Filed 2018·Granted Jan 14, 2020·0 cites·20 claims
- 3166US7224050B2Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packagingINTEL CORP·Filed 2005·Granted May 29, 2007·3 cites·11 claims
- 3264US9646903B2Thermoset polymides for microelectronic applicationsMATAYABAS JR JAMES C·Filed 2014·Granted May 9, 2017·0 cites·7 claims
- 3360US7579046B2Smart curing with a catalyst-functionalized surfaceINTEL CORP·Filed 2005·Granted Aug 25, 2009·2 cites·18 claims
- 3460US6660813B2Solid state metathesis chemistryUNIV FLORIDA·Filed 2002·Granted Dec 9, 2003·5 cites·33 claims
- 3559US8018063B2Solder joint reliability in microelectronic packagingINTEL CORP·Filed 2009·Granted Sep 13, 2011·0 cites·20 claims
- 3656US7217600B2Cyclic olefin polymers and catalyst for semiconductor applicationsINTEL CORP·Filed 2004·Granted May 15, 2007·4 cites·14 claims
- 3755US11370524B2Mechanically attached thermal protection systemBOEING CO·Filed 2018·Granted Jun 28, 2022·0 cites·20 claims
- 3855US7402642B2Linear functional copolymers of ethylene with precise and minimum run length distributions and method of making thereofEXXONMOBIL RES & ENG CO·Filed 2004·Granted Jul 22, 2008·2 cites·30 claims
- 3955US2008080950A1I and T comboLEHMAN STEPHEN D·Filed 2007·Application pending·0 cites
- 4054US2008116497A1Chip-packaging compositions including catalysts and hardeners, packages made therewith, and methods of assembling sameINTEL CORP·Filed 2008·Application pending·0 cites
- 4153US8436470B2Solder joint reliability in microelectronic packagingSUH DAEWOONG·Filed 2010·Granted May 7, 2013·0 cites·10 claims
- 4249US8643199B2Thermoset polyimides for microelectronic applicationsLEHMAN JR STEPHEN E·Filed 2009·Granted Feb 4, 2014·0 cites·2 claims
- 4348US2014252270A1Particle-based systems for removal of pollutants from gases and liquidsSDCMATERIALS INC·Filed 2014·Application pending·0 cites
- 4447US7253088B2Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making sameINTEL CORP·Filed 2004·Granted Aug 7, 2007·3 cites·12 claims
- 4544US2007284412A1Solder flux compositionPRAKASH ANNA M·Filed 2006·Application pending·0 cites
- 4640US2007029653A1Application of autonomic self healing composites to integrated circuit packagingLEHMAN STEPHEN E JR·Filed 2005·Application pending·0 cites
- 4740US2011278719A1Directing the flow of underfill materials using magnetic particlesLEHMAN JR STEPHEN E·Filed 2011·Application pending·0 cites
- 4837US2007152311A1Chip-packaging compositions including bis-maleimides, packages made therewith, and methods of assembling sameJAYARAMAN SAIKUMAR·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →