Chip-packaging compositions including catalysts and hardeners, packages made therewith, and methods of assembling same

Abstract

A chip-packaging composition includes a thermosetting resin and at least one of an N-hetero cyclic carbene adduct, an imidazole, and a cycloaliphatic amine hardener. The chip-packaging composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a mounting substrate. The mounting substrate can be further mounted on a board. A process includes formation of the chip-packaging composition. A method includes assembly of the chip-packaging composition with the flip-chip, and further can include assembly of the mounting substrate to a board. A computing system is also included that uses the chip-packaging composition.

1 . A chip-packaging composition comprising: 
 an N-heterocyclic carbine;    a resin; and    the solution, reaction, and mixture products of the composition.    
     
     
         2 . The chip-packaging composition of  claim 1 , further including a hardener.  
     
     
         3 . The chip-packaging composition of  claim 1 , wherein the N-heterocyclic carbene is present in a range from about 0.1% to about 40% of the chip-packaging composition.  
     
     
         4 . The chip-packaging composition of  claim 1 , wherein the N-heterocyclic carbene is an adduct of a carbene first compound and a second compound.  
     
     
         5 . The chip-packaging composition of  claim 1 , wherein the N-heterocyclic carbene is an adduct of a carbene first compound and a second compound, wherein the second compound is selected from an electrophilic CH-bond compound, pentabenzyl fluoride, phenolaldehyde, and combinations thereof.  
     
     
         6 . The chip-packaging composition of  claim 1 , wherein the N-heterocyclic carbene is an adduct of a carbene first compound and a second compound, and wherein the N-heterocyclic carbene includes the structure  
       
         
           
           
               
               
           
         
       
       and wherein R1 and R2 are selected from H, OH, aldehydes, alkyls, alicyclics, aryls, phenyls, and combinations thereof.  
     
     
         7 . The chip-packaging composition of  claim 1 , wherein the N-heterocyclic carbene is an adduct of a carbene first compound and a second compound, and wherein the adduct includes the structure  
       
         
           
           
               
               
           
         
       
       and Y is selected from H, aliphatics of C1-20, cycloaliphatics C1-20, branched aliphatics C1-20, aromatics C1-22, fluoroaromatics C1-22, aldehydes C1-20, ketones C1-20, ethers C1-20, amines C1-20, amides C1-20, and combinations thereof.  
     
     
         8 . The chip-packaging composition of  claim 1 , wherein the N-heterocyclic carbene is an adduct of a carbene first compound and a second compound, and wherein the N-heterocyclic carbene includes the structure  
       
         
           
           
               
               
           
         
       
       and wherein R1, R2, and R3 are selected from H, OH, aldehydes, alkyls, alicyclics, aryls, phenyls, and combinations thereof.  
     
     
         9 . The chip-packaging composition of  claim 1 , wherein the N-heterocyclic carbene is an adduct of a carbene first compound and a second compound, and wherein the adduct includes the structure  
       
         
           
           
               
               
           
         
       
       and Y is selected from H, aliphatics of C1-20, cycloaliphatics C1-20, branched aliphatics C1-20, aromatics C1-22, fluoroaromatics C1-22, aldehydes C1-20, ketones C1-20, ethers C1-20, amines C1-20, amides C1-20, and combinations thereof.  
     
     
         10 . The chip-packaging composition of  claim 1 , further including a particulate filler.  
     
     
         11 . The chip-packaging composition of  claim 1 , further including at least one additive material selected from: 
 a catalyst; an adhesion promoter; an elastomer; a filler particulate; a diluent; a hardener/crosslinker; a surfactant; a deforming agent; and a toughening agent.    
     
     
         12 . An article comprising: 
 a substrate, selected from a microelectronic die, a mounting substrate, and a board; and    a chip-packaging composition in contact with the substrate, wherein the chip-packaging composition includes an N-heterocyclic carbene; a resin; and the solution, reaction, and mixture products of the composition.    
     
     
         13 . The article of  claim 12 , wherein the substrate includes a mounting substrate disposed on the chip-packaging composition on a first side thereof, and further including a microelectronic die second substrate disposed on the chip-packaging composition on a second side thereof.  
     
     
         14 . The article of  claim 12 , further including a cycloaliphatic amine hardener.  
     
     
         15 . An article comprising: 
 a substrate, selected from a microelectronic die, a mounting substrate, and a board; and    a chip-packaging composition in contact with the substrate, wherein the chip-packaging composition includes a cycloaliphatic amine hardener; a resin; and the solution, reaction, and mixture products of the composition.    
     
     
         16 . The article of  claim 15 , wherein the substrate includes a mounting substrate disposed on the chip-packaging composition on a first side thereof, and further including a microelectronic die second substrate disposed on the chip-packaging composition on a second side thereof.  
     
     
         17 . The article of  claim 15 , further including an N-heterocyclic carbene catalyst in a percent weight presence in a range from about 5% to about 35%.  
     
     
         18 . A chip-packaging composition comprising: 
 an imidazole catalyst;    a resin; and    the solution, reaction, and mixture products of the composition.    
     
     
         19 . The chip-packaging composition of  claim 18 , wherein the imidazole catalyst includes a diamine hardener.  
     
     
         20 . The chip-packaging composition of  claim 18 , wherein the imidazole catalyst is selected from  
       
         
           
           
               
               
           
         
       
     
     
         21 . An article comprising: 
 a substrate, selected from a microelectronic die, a mounting substrate, and a board; and    a chip-packaging composition in contact with the substrate, wherein the chip-packaging composition includes an imidazole catalyst; a resin; and the solution, reaction, and mixture products of the composition.    
     
     
         22 . The article of  claim 21 , wherein the substrate includes a mounting substrate disposed on the chip-packaging composition on a first side thereof, and further including a microelectronic die second substrate disposed on the chip-packaging composition on a second side thereof.  
     
     
         23 . The article of  claim 21 , wherein the imidazole catalyst is present in range from about 2% to about 15%.  
     
     
         24 . A process comprising: 
 contacting a chip-packaging composition with a substrate, the chip-packaging composition including: 
 an N-heterocyclic carbene adduct;  
 a resin; and  
 the solution, reaction, and mixture products of the composition; and  
   curing the chip-packaging composition at a temperature below about 150° C.    
     
     
         25 . The process of  claim 24 , wherein curing is carried out in a temperature range from about 45° C. to about 145° C.  
     
     
         26 . The process of  claim 24 , wherein the chip-packaging composition further includes a cycloaliphatic amine hardener, and wherein curing includes first beginning to react the hardener at a first temperature and second beginning to cleave the carbene at a second temperature, wherein the first temperature is lower than the second temperature.  
     
     
         27 . A process comprising: 
 contacting a chip-packaging composition with a substrate, the chip-packaging composition including: 
 a cycloaliphatic amine hardener;  
 a resin; and  
 the solution, reaction, and mixture products of the composition; and  
   curing the chip-packaging composition at a temperature below about 80° C.    
     
     
         28 . The process of  claim 27 , wherein curing is carried out in a temperature range from about 45° C. to about 70° C.  
     
     
         29 . The process of  claim 27 , wherein the chip-packaging composition further includes at least one of an N-heterocyclic carbene catalyst, and wherein curing includes first beginning to react the hardener at a first temperature and second beginning to cleave the carbene at a second temperature, wherein the first temperature is lower than the second temperature.  
     
     
         30 . A process comprising: 
 contacting a chip-packaging composition with a substrate, the chip-packaging composition including: 
 an imidazole catalyst;  
 a resin; and  
 the solution, reaction, and mixture products of the composition; and  
   curing the chip-packaging composition at a temperature below about 80° C.    
     
     
         31 . The process of  claim 30 , wherein curing is carried out in a temperature range from about room temperature to about 70° C.  
     
     
         32 . The process of  claim 30 , wherein the chip-packaging composition further includes a cycloaliphatic hardener, and wherein curing includes first beginning to react the hardener at a first temperature and second activating the imidazole catalyst at a second temperature, wherein the first temperature is lower than the second temperature.  
     
     
         33 . A computing system comprising: 
 a microelectronic die;    a mounting substrate, wherein the die is coupled to the mounting substrate through a solder first bump;    a chip-packaging composition, wherein the chip-packaging composition includes a thermosetting resin and a residue derived from an N-heterocyclic carbene adduct; and    a dynamic random-access storage device coupled to the microelectronic die.    
     
     
         34 . The computing system of  claim 33 , wherein the computing system is disposed in one of a computer, a wireless communicator, a hand-held device, an automobile, a locomotive, an aircraft, a watercraft, and a spacecraft, and wherein the microelectronic die is selected from a data storage device, a digital signal processor, a micro controller, an application specific integrated circuit, and a microprocessor.  
     
     
         35 . A computing system comprising: 
 a microelectronic die;    a mounting substrate, wherein the die is coupled to the mounting substrate through a solder first bump;    a chip-packaging composition, wherein the chip-packaging composition includes a thermosetting resin and a residue derived from a cycloaliphatic amine hardener; and    a dynamic random-access storage device coupled to the microelectronic die.    
     
     
         36 . The computing system of  claim 35 , wherein the computing system is disposed in one of a computer, a wireless communicator, a hand-held device, an automobile, a locomotive, an aircraft, a watercraft, and a spacecraft, and wherein the microelectronic die is selected from a data storage device, a digital signal processor, a micro controller, an application specific integrated circuit, and a microprocessor.  
     
     
         37 . A computing system comprising: 
 a microelectronic die;    a mounting substrate, wherein the die is coupled to the mounting substrate through a solder first bump;    a chip-packaging composition, wherein the chip-packaging composition includes a thermosetting resin and a residue derived from an imidazole catalyst; and    a dynamic random-access storage device coupled to the microelectronic die.    
     
     
         38 . The computing system of  claim 37 , wherein the imidazole catalyst includes a diamine hardener.  
     
     
         39 . The computing system of  claim 37 , wherein the computing system is disposed in one of a computer, a wireless communicator, a hand-held device, an automobile, a locomotive, an aircraft, a watercraft, and a spacecraft, and wherein the microelectronic die is selected from a data storage device, a digital signal processor, a micro controller, an application specific integrated circuit, and a microprocessor.  
     
     
         40 . A chip-packaging composition comprising: 
 a cycloaliphatic amine hardener, wherein the cycloaliphatic amine hardener includes a diamine hardener, selected from:                           and combinations thereof; 
 an epoxy resin; and  
   the solution, reaction, and mixture products of the composition.    
     
     
         41 . The chip-packaging composition of  claim 40 , further including a catalyst.  
     
     
         42 . The chip-packaging composition of  claim 40 , further including an adhesion promoter.  
     
     
         43 . The chip-packaging composition of  claim 40 , further including a reactive diluent.  
     
     
         44 . The chip-packaging composition of  claim 40 , further including a surfactant.  
     
     
         45 . The chip-packaging composition of  claim 40 , further including a deforming agent.  
     
     
         46 . The chip-packaging composition of  claim 40 , further including a toughening agent.