Inventor · disambiguated record
Salvatore Frank Pavone
Also filed as: PAVONE SALVATORE · PAVONE SALVATORE FRANK
25 granted patents·11 pending applications·12 citations·filing 2003–2024
92Inventor score
Top patents by PatentIndex Score
36 records- 0193US10453817B1Zinc-cobalt barrier for interface in solder bond applicationsTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 22, 2019·7 cites·20 claims
- 0280US10692830B2Multilayers of nickel alloys as diffusion barrier layersTEXAS INSTRUMENTS INC·Filed 2018·Granted Jun 23, 2020·2 cites·14 claims
- 0379US2024421045A1Die attach surface copper layer with protective layer for microelectronic devicesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0473US11984418B2Method of forming brass-coated metals in flip-chip redistribution layersTEXAS INSTRUMENTS INC·Filed 2022·Granted May 14, 2024·0 cites·13 claims
- 0573US10566267B2Die attach surface copper layer with protective layer for microelectronic devicesTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 18, 2020·1 cites·20 claims
- 0673US2024413114A1Conductive members for die attach in flip chip packagesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0772US11587858B2Zinc-cobalt barrier for interface in solder bond applicationsTEXAS INSTRUMENTS INC·Filed 2021·Granted Feb 21, 2023·0 cites·17 claims
- 0872US2020020656A1Alloy diffusion barrier layerTEXAS INSTRUMENTS INC·Filed 2019·Application pending·0 cites
- 0970US10424552B2Alloy diffusion barrier layerTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 24, 2019·0 cites·20 claims
- 1068US11594504B2Nickel alloy for semiconductor packagingTEXAS INSTRUMENTS INC·Filed 2021·Granted Feb 28, 2023·0 cites·15 claims
- 1168US2022173062A1Multilayers of nickel alloys as diffusion barrier layersTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 1267US12237219B2Contact with bronze material to mitigate undercutTEXAS INSTRUMENTS INC·Filed 2020·Granted Feb 25, 2025·0 cites·20 claims
- 1367US12074096B2Die attach surface copper layer with protective layer for microelectronic devicesTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 27, 2024·0 cites·12 claims
- 1466US12068221B2Plating for thermal managementTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 20, 2024·0 cites·11 claims
- 1566US10629334B2Nanostructure barrier for copper wire bondingTEXAS INSTRUMENTS INC·Filed 2018·Granted Apr 21, 2020·0 cites·10 claims
- 1666US2024153903A1Flip chip package assemblyTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1764US11127515B2Nanostructure barrier for copper wire bondingTEXAS INSTRUMENTS INC·Filed 2020·Granted Sep 21, 2021·0 cites·15 claims
- 1863US11876065B2Flip chip package assemblyTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 16, 2024·0 cites·17 claims
- 1963US11011488B2Zinc-cobalt barrier for interface in solder bond applicationsTEXAS INSTRUMENTS INC·Filed 2019·Granted May 18, 2021·0 cites·20 claims
- 2063US2020321299A1Multilayers of nickel alloys as diffusion barrier layersTEXAS INSTRUMENTS INC·Filed 2020·Application pending·0 cites
- 2162US2023005807A1Zinc Layer For A Semiconductor Die PillarTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2261US11410947B2Brass-coated metals in flip-chip redistribution layersTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 9, 2022·0 cites·20 claims
- 2360US2024194574A1Process for thin film capacitor integrationTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2458US10734304B2Plating for thermal managementTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 4, 2020·0 cites·20 claims
- 2557US7573086B2TaN integrated circuit (IC) capacitorTEXAS INSTRUMENTS INC·Filed 2005·Granted Aug 11, 2009·2 cites·19 claims
- 2656US11855024B2Wafer chip scale packages with visible solder filletsTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 26, 2023·0 cites·22 claims
- 2756US11011483B2Nickel alloy for semiconductor packagingTEXAS INSTRUMENTS INC·Filed 2018·Granted May 18, 2021·0 cites·11 claims
- 2856US10796956B2Contact fabrication to mitigate undercutTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 6, 2020·0 cites·14 claims
- 2954US12100678B2Conductive members for die attach in flip chip packagesTEXAS INSTRUMENTS INC·Filed 2019·Granted Sep 24, 2024·0 cites·33 claims
- 3054US2024096771A1Wafer based molded flip chip routable ic packageTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 3151US11443996B2Zinc layer for a semiconductor die pillarTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 13, 2022·0 cites·14 claims
- 3250US11362020B2Flipchip package with an IC having a covered cavity comprising metal postsTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 14, 2022·0 cites·21 claims
- 3349US11948871B2Process for thin film capacitor integrationTEXAS INSTRUMENTS INC·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 3446US2022415762A1Semiconductor package with drilled mold cavityTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 3540US2004261815A1Three-step chamber cleaning process for deposition toolsTEXAS INSTRUMENTS INC·Filed 2003·Application pending·0 cites
- 3630US8470614B2PECVD showerhead configuration for CMP uniformity and improved stressNEW JASON JAMES·Filed 2011·Granted Jun 25, 2013·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →